Intel Corporation
EPF10K130EFC672-2
EPF10K130EFC672-2 ECAD Model
EPF10K130EFC672-2 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 500 ps | |
| Number of Inputs | 413 | |
| Number of Outputs | 413 | |
| Number of Logic Cells | 6656 | |
| Number of I/O Lines | 413 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 413 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672 | |
| Pin Count | 672 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K130EFC672-2 Overview
The chip model EPF10K130EFC672-2 is a powerful and versatile device that can be used in a wide range of applications. It is designed with advanced features and technologies, making it an ideal choice for many industries. This chip model has several advantages, such as low power consumption, high performance, and high scalability. It also has an integrated circuit design that supports multiple communication protocols, making it suitable for use in various communication systems.
The EPF10K130EFC672-2 chip model is expected to be in high demand in the future due to its unique features and capabilities. Its low power consumption and high performance make it an ideal choice for a variety of applications, including those in the industrial and automotive sectors. Additionally, its scalability makes it suitable for use in networks and intelligent systems.
The original design intention of the EPF10K130EFC672-2 chip model was to provide an efficient and reliable platform for communication systems. This chip model is capable of supporting multiple communication protocols and is designed to be easily upgradable. In addition to its current capabilities, the chip model can be upgraded to support advanced communication systems, allowing it to be used in a variety of scenarios.
The EPF10K130EFC672-2 chip model is also expected to be used in networks and intelligent systems in the future. It has the potential to be used in the era of fully intelligent systems, as it can be used to facilitate communication between various devices and systems. Additionally, the chip model can be used in various scenarios, such as in the Internet of Things (IoT) and in smart homes.
Overall, the EPF10K130EFC672-2 chip model is a powerful and versatile device with several advantages. It is expected to be in high demand in the future due to its low power consumption, high performance, and scalability. Additionally, its design allows it to be easily upgradable, making it suitable for use in advanced communication systems. Finally, the chip model has the potential to be used in networks and intelligent systems, making it a great choice for the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||