Intel Corporation
EPF10K130EFC672-1
EPF10K130EFC672-1 ECAD Model
EPF10K130EFC672-1 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 300 ps | |
| Number of Inputs | 413 | |
| Number of Outputs | 413 | |
| Number of Logic Cells | 6656 | |
| Number of I/O Lines | 413 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 413 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPF10K130EFC672-1 Datasheet Download
EPF10K130EFC672-1 Overview
The chip model EPF10K130EFC672-1 is a powerful and versatile model that has been widely used in the chip industry. It is a high-performance, low-power, and high-density integrated circuit that can be used in a variety of applications. It is a cost-effective solution for many applications, such as digital signal processing, communication systems, and embedded systems.
The chip model EPF10K130EFC672-1 is designed to meet the needs of the industry in the future. It is designed to be upgradeable and can be used in advanced communication systems. It has the capability to support new technologies and can be used in a wide range of applications. It is also designed to be used in the era of fully intelligent systems, as it can be applied to networks and intelligent scenarios.
The chip model EPF10K130EFC672-1 is a versatile model that has a wide range of applications. It can be used in digital signal processing, communication systems, embedded systems, and more. It is also designed to be upgradeable, so it can be used in the future and can support new technologies. It can also be used in the era of fully intelligent systems, as it can be used in networks and intelligent scenarios.
The chip model EPF10K130EFC672-1 is a powerful and versatile model that can be used in a variety of applications. It is a cost-effective solution for many applications and is designed to be upgradeable. It can be used in advanced communication systems and can support new technologies. It can also be used in the era of fully intelligent systems, as it can be applied to networks and intelligent scenarios. As a result, the chip model EPF10K130EFC672-1 is an ideal choice for many applications in the industry.
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1,133 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $532.9311 | $532.9311 |
| 10+ | $527.2007 | $5,272.0066 |
| 100+ | $498.5485 | $49,854.8454 |
| 1000+ | $469.8962 | $234,948.1220 |
| 10000+ | $429.7832 | $429,783.1500 |
| The price is for reference only, please refer to the actual quotation! | ||