Intel Corporation
EPF10K130EFC484-3N
EPF10K130EFC484-3N ECAD Model
EPF10K130EFC484-3N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 600 ps | |
| Number of Inputs | 369 | |
| Number of Outputs | 369 | |
| Number of Logic Cells | 6656 | |
| Number of I/O Lines | 369 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 369 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA484,22X22,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPF10K130EFC484-3N Datasheet Download
EPF10K130EFC484-3N Overview
The EPF10K130EFC484-3N chip model is a high-performance device developed for digital signal processing, embedded processing, image processing, and other related applications. It is designed to provide a powerful and reliable solution for these tasks, and is capable of meeting the needs of a wide variety of users.
The EPF10K130EFC484-3N chip model is based on the Altera FPGA technology, and is based on the EFC484-3N architecture. This architecture is designed to provide a comprehensive set of features and capabilities, including a high-speed, low-power, and flexible design. The chip model is capable of operating at up to 130 MHz, and is capable of handling a wide range of data types, including 16-bit and 32-bit data types.
The EPF10K130EFC484-3N chip model is designed to support the HDL language for programming and design. This language is well-suited for the development of high-performance digital signal processing and embedded processing applications, and it is also capable of supporting the development of image processing applications.
The original design intention of the EPF10K130EFC484-3N chip model was to provide a high-performance and reliable solution for digital signal processing, embedded processing, image processing, and other related applications. The chip model is capable of meeting the needs of a wide variety of users, and is also capable of being upgraded in the future, should the need arise.
The EPF10K130EFC484-3N chip model is also applicable to advanced communication systems. This chip model is capable of handling high-speed data transmission, and can be used in a variety of advanced communication systems, including wireless communication systems, optical communication systems, and satellite communication systems.
When designing with the EPF10K130EFC484-3N chip model, it is important to consider the product description and design requirements. This chip model is designed to provide a high-performance solution for digital signal processing and embedded processing applications, and it is important to consider the specific design requirements of the application. Additionally, it is important to consider the actual case studies and precautions when designing with the chip model.
In conclusion, the EPF10K130EFC484-3N chip model is a high-performance device designed for digital signal processing, embedded processing, image processing, and other related applications. It is capable of meeting the needs of a wide variety of users, and is also capable of being upgraded in the future, should the need arise. Additionally, the chip model is applicable to advanced communication systems, and it is important to consider the product description and design requirements, as well as actual case studies and precautions, when designing with the chip model.
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5,395 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $213.5578 | $213.5578 |
| 10+ | $211.2614 | $2,112.6144 |
| 100+ | $199.7798 | $19,977.9840 |
| 1000+ | $188.2982 | $94,149.1200 |
| 10000+ | $172.2240 | $172,224.0000 |
| The price is for reference only, please refer to the actual quotation! | ||