Intel Corporation
EPF10K130EFC484-1N
EPF10K130EFC484-1N ECAD Model
EPF10K130EFC484-1N Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 300 ps | |
| Number of Inputs | 369 | |
| Number of Outputs | 369 | |
| Number of Logic Cells | 6656 | |
| Number of I/O Lines | 369 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 369 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA484,22X22,40 | |
| Pin Count | 484 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K130EFC484-1N Overview
The chip model EPF10K130EFC484-1N is a cutting-edge integrated circuit developed by Altera Corporation. It is designed to provide reliable and efficient performance in a wide range of applications, including embedded systems, digital signal processing, and communication systems. This chip model is based on a field-programmable gate array (FPGA) architecture and provides a number of features that make it suitable for a variety of applications.
The EPF10K130EFC484-1N is a high-performance device that is capable of providing a wide range of functions. It has a high-speed transceiver, a high-performance memory controller, and a powerful processor. Additionally, it also includes a number of other features such as a flexible clock management unit, a power-saving mode, and configurable I/O.
The EPF10K130EFC484-1N is designed to provide reliable and efficient performance in a wide range of applications. It can be used in advanced communication systems, such as high-speed networks and wireless systems. It can also be used in embedded systems, digital signal processing, and other applications. The chip model is also capable of being upgraded in the future, making it suitable for use in advanced applications.
When it comes to the application environment of the EPF10K130EFC484-1N, there are a number of factors to consider. The chip model is designed to be used in a wide range of applications, and it is important to consider the specific technologies needed for the application environment. This includes the type of communication protocols, the types of data that need to be processed, and the type of processor needed to run the application. Additionally, it is important to consider the power requirements of the application, as well as the size and complexity of the application.
When selecting the EPF10K130EFC484-1N for an application, it is important to consider the product description and specific design requirements. It is also important to consider the actual case studies and precautions associated with the chip model. This includes the power requirements, the clock speed, the thermal design, and the I/O design. Additionally, it is important to consider the compatibility of the chip model with other components in the system, as well as the compatibility of the chip model with the application environment.
In conclusion, the EPF10K130EFC484-1N is a cutting-edge integrated circuit designed to provide reliable and efficient performance in a wide range of applications. It is important to consider the application environment and the specific technologies needed for the application when selecting the chip model. Additionally, it is important to consider the product description and specific design requirements, as well as the actual case studies and precautions associated with the chip model.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||