Intel Corporation
EPF10K130EBC356-2X
EPF10K130EBC356-2X ECAD Model
EPF10K130EBC356-2X Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 500 ps | |
| Number of Inputs | 274 | |
| Number of Outputs | 274 | |
| Number of Logic Cells | 6656 | |
| Number of I/O Lines | 274 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 274 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B356 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 356 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA356,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.63 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LBGA, BGA356,26X26,50 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPF10K130EBC356-2X Datasheet Download
EPF10K130EBC356-2X Overview
The chip model EPF10K130EBC356-2X is a high-performance integrated circuit designed for digital signal processing, embedded processing, and image processing. It is designed to be used with a hardware description language (HDL) and provides a wide range of features and capabilities.
The EPF10K130EBC356-2X chip model offers a range of advantages over other models. It has a high processing power, allowing it to handle complex tasks quickly and efficiently. It is also designed to be highly reliable and durable, making it an ideal choice for applications that require long-term performance. Additionally, it is designed to be energy-efficient, helping to reduce power consumption.
The EPF10K130EBC356-2X chip model is expected to be in high demand in the future. It is a perfect choice for applications that require high performance and reliability, such as digital signal processing, embedded processing, and image processing. It is also a great option for applications that need to be energy-efficient, as it is designed to consume less power.
The original design intention of the EPF10K130EBC356-2X chip model was to provide a reliable and efficient solution for digital signal processing, embedded processing, and image processing. It was designed to be used with a hardware description language (HDL) and provides a wide range of features and capabilities. The chip model was also designed to be upgradable, allowing it to keep up with the latest technologies and advancements in the field.
The EPF10K130EBC356-2X chip model is a great option for advanced communication systems. It is designed to be highly reliable and energy-efficient, making it an ideal choice for applications that require long-term performance. Additionally, it is designed to be upgradable, allowing it to keep up with the latest technologies and advancements in the field. This makes it a great choice for applications that need to stay up-to-date and be able to handle complex tasks quickly and efficiently.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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