
Intel Corporation
EPF10K100EFI484-2N
EPF10K100EFI484-2N ECAD Model
EPF10K100EFI484-2N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 500 ps | |
Number of Inputs | 338 | |
Number of Outputs | 338 | |
Number of Logic Cells | 4992 | |
Number of I/O Lines | 338 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 338 I/O | |
Output Function | MIXED | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B484 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 484 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.1 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA484,22X22,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
EPF10K100EFI484-2N Datasheet Download
EPF10K100EFI484-2N Overview
The chip model EPF10K100EFI484-2N has been an important part of the semiconductor industry for many years. It is a highly integrated, high-performance and low-power Field Programmable Gate Array (FPGA) chip, which is widely used in many areas such as aerospace, medical, industrial, and communications. As the industry continues to develop, this model has become increasingly popular, and its applications have become more and more diversified.
The chip model EPF10K100EFI484-2N has the characteristics of high integration, low power consumption, and high performance, which makes it an ideal choice for many applications such as network control, data analysis, and signal processing. In the era of fully intelligent systems, it can be used in many intelligent scenarios such as intelligent robots, intelligent vehicles, and smart homes. It can also be used in the development and popularization of future intelligent robots, which requires a variety of technical talents to use the model effectively.
In addition, the chip model EPF10K100EFI484-2N also has the ability to support new technologies, such as artificial intelligence, Internet of Things, and cloud computing. These technologies are essential for the development of the industry, and the model can provide the necessary support for them. In the future, the chip model EPF10K100EFI484-2N will continue to play an important role in the development of the industry and will be widely used in many applications.
To sum up, the chip model EPF10K100EFI484-2N has been an important part of the semiconductor industry for many years and is widely used in many areas such as aerospace, medical, industrial, and communications. Its high integration, low power consumption, and high performance make it an ideal choice for many applications. In the future, it will continue to play an important role in the development of the industry and will be used in many intelligent scenarios such as intelligent robots, intelligent vehicles, and smart homes. It also has the ability to support new technologies, such as artificial intelligence, Internet of Things, and cloud computing. Therefore, it is an indispensable tool for the development and popularization of future intelligent robots, and requires a variety of technical talents to use the model effectively.
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QTY | Unit Price | Ext Price |
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