Intel Corporation
EPF10K100EBI356-3
EPF10K100EBI356-3 ECAD Model
EPF10K100EBI356-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 16 ns | |
| Number of Inputs | 274 | |
| Number of Outputs | 274 | |
| Number of Logic Cells | 4992 | |
| Number of I/O Lines | 274 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 274 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B356 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 356 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA356,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.63 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LBGA, BGA356,26X26,50 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K100EBI356-3 Datasheet Download
EPF10K100EBI356-3 Overview
The chip model EPF10K100EBI356-3 is the latest offering from a leading semiconductor manufacturer, and it has been designed with a variety of advantages to meet the needs of the modern consumer. This model is designed to be extremely efficient in terms of power consumption, while still providing excellent performance and reliability. It is also designed to be highly scalable, allowing for future upgrades in terms of speed and capacity.
The EPF10K100EBI356-3 is expected to be in high demand in the coming years due to its impressive performance and scalability. It is ideal for use in a variety of industries, such as telecommunications, consumer electronics, and automotive. In these industries, the chip model can be used to increase the speed and efficiency of existing systems, as well as for the development of new products. Additionally, it can be used in the development of advanced communication systems, allowing for faster data transfer and more secure communications.
The EPF10K100EBI356-3 is also suitable for use in the development and popularization of future intelligent robots. This chip model has the potential to be used in a variety of robotic applications, from autonomous vehicles to intelligent home assistants. To use this model effectively, technical professionals with experience in robotics and artificial intelligence will be needed.
Overall, the chip model EPF10K100EBI356-3 is an impressive offering from a leading semiconductor manufacturer. It is designed to be highly efficient and scalable, making it ideal for a variety of industries. It is expected to be in high demand in the coming years, and it is suitable for use in the development and popularization of future intelligent robots. With the right technical professionals, this chip model can be used to create a variety of powerful and efficient applications.
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5,600 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||