Intel Corporation
EPF10K100EBC356-2N
EPF10K100EBC356-2N ECAD Model
EPF10K100EBC356-2N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 500 ps | |
| Number of Inputs | 274 | |
| Number of Outputs | 274 | |
| Number of Logic Cells | 4992 | |
| Number of I/O Lines | 274 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 274 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B356 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 356 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA356,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.63 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LBGA, BGA356,26X26,50 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPF10K100EBC356-2N Datasheet Download
EPF10K100EBC356-2N Overview
The chip model EPF10K100EBC356-2N is a high-performance programmable logic device created by Altera Corporation. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It requires the use of HDL language.
The EPF10K100EBC356-2N chip model is designed to meet the needs of a wide range of industries, from automotive to aerospace, from medical to industrial automation. It features a low-power, high-speed architecture that enables it to handle complex tasks quickly and efficiently. It also offers high levels of integration, allowing for the integration of multiple functions onto a single chip.
The EPF10K100EBC356-2N chip model offers several advantages that make it a valuable asset for many industries. It is capable of operating at high speeds while consuming very little power. This makes it ideal for applications that require high performance and low power consumption. Additionally, its flexibility and scalability make it a great choice for applications that require a wide range of features and functions.
The EPF10K100EBC356-2N chip model is also well-suited for applications that require the use of new technologies. It offers support for a variety of programming languages, making it easy to integrate new technologies into existing systems. It also offers support for high-speed communication protocols, making it suitable for applications that require high-speed data transfer.
The EPF10K100EBC356-2N chip model is expected to experience increasing demand in the future, as more industries turn to it for their high-performance applications. Its low power consumption, high-speed architecture, and scalability make it an attractive option for many industries. Additionally, its support for new technologies and high-speed communication protocols make it a great choice for applications that require the use of new technologies. As more industries continue to adopt the EPF10K100EBC356-2N chip model, its demand is expected to continue to grow.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||