Intel Corporation
EPF10K100AFC484-3
EPF10K100AFC484-3 ECAD Model
EPF10K100AFC484-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 800 ps | |
| Number of Inputs | 406 | |
| Number of Outputs | 406 | |
| Number of Logic Cells | 4992 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 369 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 369 I/O | |
| Additional Feature | 4992 LOGIC ELEMENTS; 624 LABS | |
| Clock Frequency-Max | 80 MHz | |
| Output Function | REGISTERED | |
| Power Supplies | 2.5/3.3,3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA484,22X22,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K100AFC484-3 Datasheet Download
EPF10K100AFC484-3 Overview
The chip model EPF10K100AFC484-3 is a device used for various electronic applications. It is designed to be used in a wide range of applications, from consumer electronics to industrial automation. As technology advances, the chip model EPF10K100AFC484-3 has the potential to become even more powerful.
The EPF10K100AFC484-3 chip model is designed to be a low-power and low-cost solution for a variety of applications. It is designed to be able to handle a wide range of workloads, from simple tasks to more complex ones. It is also designed to be able to handle multiple tasks in parallel, making it a great choice for applications that require high performance.
The EPF10K100AFC484-3 chip model is designed to be highly reliable and efficient. It is designed to be able to handle a wide range of workloads, from simple to more complex tasks. It also has a low power consumption, making it a great choice for applications that require low power consumption. In addition, it is also designed to be able to handle multiple tasks in parallel, making it a great choice for applications that require high performance.
The EPF10K100AFC484-3 chip model is designed to be highly reliable and efficient. It is designed to have a high degree of scalability, meaning it can be used in a wide range of applications. It is also designed to be able to handle multiple tasks in parallel, making it a great choice for applications that require high performance.
The EPF10K100AFC484-3 chip model is expected to be in high demand in the near future. It is expected to be used in a wide range of applications, from consumer electronics to industrial automation. It is also expected to be used in advanced communication systems, as it is designed to be able to handle multiple tasks in parallel.
The original design intention of the EPF10K100AFC484-3 chip model was to be a low-cost and low-power solution for a variety of applications. It is also designed to be highly reliable and efficient. In addition, it is designed to be able to handle multiple tasks in parallel. As technology advances, the chip model has the potential to be upgraded in the future, making it even more powerful and efficient.
The EPF10K100AFC484-3 chip model is expected to be in high demand in the near future. It is designed to be a low-cost and low-power solution for a variety of applications. It is also designed to be highly reliable and efficient. In addition, it is designed to be able to handle multiple tasks in parallel, making it a great choice for applications that require high performance.
In conclusion, the EPF10K100AFC484-3 chip model is a great choice for a wide range of applications. It is designed to be a low-cost and low-power solution for a variety of applications. It is also designed to be highly reliable and efficient. In addition, it is designed to be able to handle multiple tasks in parallel, making it a great choice for applications that require high performance. As technology advances, the chip model has the potential to be upgraded in the future, making it even more powerful and efficient.
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1,619 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $215.6112 | $215.6112 |
| 10+ | $213.2928 | $2,132.9280 |
| 100+ | $201.7008 | $20,170.0800 |
| 1000+ | $190.1088 | $95,054.4000 |
| 10000+ | $173.8800 | $173,880.0000 |
| The price is for reference only, please refer to the actual quotation! | ||