Intel Corporation
EPF10K100ABI356-3N
EPF10K100ABI356-3N ECAD Model
EPF10K100ABI356-3N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 800 ps | |
| Number of Inputs | 274 | |
| Number of Outputs | 274 | |
| Number of Logic Cells | 4992 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 274 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 274 I/O | |
| Output Function | REGISTERED | |
| Power Supplies | 2.5/3.3,3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B356 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 356 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA356,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.63 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LBGA, BGA356,26X26,50 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K100ABI356-3N Datasheet Download
EPF10K100ABI356-3N Overview
The chip model EPF10K100ABI356-3N has become increasingly popular in the industry due to its high performance and reliability. It is a low-power, high-performance, field-programmable gate array (FPGA) device that is used in a variety of applications from embedded computing to communication systems.
The EPF10K100ABI356-3N is designed to provide users with a high level of flexibility and control. It has a wide range of features, including a low-power, low-cost, and high-speed design, as well as the ability to be programmed and reprogrammed for different applications. The chip also includes a wide range of I/O and memory interfaces, making it suitable for a variety of applications.
The EPF10K100ABI356-3N is designed to be used in a wide range of applications, such as medical, automotive, industrial, and consumer electronics. It is also designed to be used in a variety of communication systems, such as Bluetooth, Wi-Fi, and ZigBee. The chip is also designed to be used in advanced communication systems, such as 5G, LTE, and WiMAX.
In terms of industry trends, the EPF10K100ABI356-3N is becoming increasingly popular due to its performance, cost, and flexibility. As the demand for more advanced communication systems increases, the chip is expected to become even more popular. In terms of future upgrades, the chip is designed to be upgradeable, allowing users to easily update the firmware and software to meet their needs.
In terms of product description and design requirements, the EPF10K100ABI356-3N is designed to be a low-power, low-cost, and high-speed FPGA device. It is designed to be used in a variety of applications, including embedded computing, communication systems, and advanced communication systems. The chip is also designed to be used in a variety of communication systems, such as Bluetooth, Wi-Fi, and ZigBee.
In terms of actual case studies, the EPF10K100ABI356-3N has been used in a variety of applications, such as medical, automotive, industrial, and consumer electronics. In terms of precautions, users should be aware of the power consumption of the chip and the potential for overheating. In addition, users should also be aware of the potential for electromagnetic interference and the need for proper shielding.
In conclusion, the chip model EPF10K100ABI356-3N is a low-power, high-performance, field-programmable gate array (FPGA) device that is used in a variety of applications from embedded computing to communication systems. It is becoming increasingly popular due to its performance, cost, and flexibility, and is expected to become even more popular as the demand for more advanced communication systems increases. The chip is designed to be upgradeable, allowing users to easily update the firmware and software to meet their needs. In terms of actual case studies, the chip has been used in a variety of applications, and users should be aware of the power consumption of the chip and the potential for overheating, as well as the potential for electromagnetic interference and the need for proper shielding.
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2,268 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $354.8186 | $354.8186 |
| 10+ | $351.0034 | $3,510.0337 |
| 100+ | $331.9271 | $33,192.7098 |
| 1000+ | $312.8508 | $156,425.4140 |
| 10000+ | $286.1441 | $286,144.0500 |
| The price is for reference only, please refer to the actual quotation! | ||