Intel Corporation
EPF10K100ABI356-3
EPF10K100ABI356-3 ECAD Model
EPF10K100ABI356-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 800 ps | |
| Number of Inputs | 274 | |
| Number of Outputs | 274 | |
| Number of Logic Cells | 4992 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 274 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 274 I/O | |
| Output Function | REGISTERED | |
| Power Supplies | 2.5/3.3,3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B356 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 356 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA356,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN/LEAD (SN63PB37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.63 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LBGA, BGA356,26X26,50 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K100ABI356-3 Datasheet Download
EPF10K100ABI356-3 Overview
The chip model EPF10K100ABI356-3 is a powerful and versatile model that has many advantages over existing models. It is designed to meet the needs of the most demanding applications, such as high-end networking, intelligent systems and robotics. This model is expected to be in high demand in the future as more and more companies and industries look to implement advanced technologies.
The EPF10K100ABI356-3 model is ideal for use in networks and intelligent scenarios. It is designed to provide a highly reliable and secure connection that can be used for a variety of applications. It can also be used for the development and popularization of future intelligent robots. This could include robots that are able to interact with their environment, recognize objects, and even make decisions based on data.
The EPF10K100ABI356-3 model is also capable of handling large amounts of data and processing it quickly. This makes it ideal for use in the era of fully intelligent systems. It is capable of handling complex tasks, such as artificial intelligence and machine learning. In order to use the model effectively, technical talents such as engineers and software developers are needed.
Overall, the EPF10K100ABI356-3 model is a powerful and versatile chip model that is expected to be in high demand in the future. It is capable of handling a variety of tasks, from networking to robotics, and can be used in the era of fully intelligent systems. In order to use the model effectively, technical talents are needed.
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3,661 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $80.3520 | $80.3520 |
| 10+ | $79.4880 | $794.8800 |
| 100+ | $75.1680 | $7,516.8000 |
| 1000+ | $70.8480 | $35,424.0000 |
| 10000+ | $64.8000 | $64,800.0000 |
| The price is for reference only, please refer to the actual quotation! | ||