EP4SGX360NF45C3
EP4SGX360NF45C3
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Intel Corporation

EP4SGX360NF45C3


EP4SGX360NF45C3
F18-EP4SGX360NF45C3
Active
IC FPGA 920 I/O 1932FBGA
1932-FBGA, FC (45x45)

EP4SGX360NF45C3 ECAD Model


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EP4SGX360NF45C3 Attributes


Type Description Select
Mfr Intel
Series Stratix® IV GX
Package Tray
Number of LABs/CLBs 14144
Number of Logic Elements/Cells 353600
Total RAM Bits 23105536
Number of I/O 920
Voltage - Supply 0.87V ~ 0.93V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1932-BBGA, FCBGA
Supplier Device Package 1932-FBGA, FC (45x45)
Base Product Number EP4SGX360

EP4SGX360NF45C3 Datasheet Download


EP4SGX360NF45C3 Overview



The EP4SGX360NF45C3 is an FPGA (Field Programmable Gate Array) chip model manufactured by Altera Corporation. It is a high-performance, low-cost FPGA device targeted at applications requiring high-speed, high-density logic and memory resources. The chip is built using a 0.13-micron CMOS process and is suitable for a wide range of applications, including high-speed networking, digital signal processing, communications, embedded systems and more.


The chip has a total of 360,000 logic elements and 6.5 million system gates. It also features 4,096 Kbits of embedded memory and a total of 4,096 I/O pins. It has a maximum clock frequency of 300MHz and a total power dissipation of 6.5W. It operates at a temperature range of -40°C to +85°C.


The EP4SGX360NF45C3 is suitable for a wide range of applications, including high-speed networking, digital signal processing, communications, embedded systems, and more. It is ideal for applications requiring high-speed, high-density logic and memory resources. It is also suitable for applications requiring low power consumption, such as portable and battery-powered devices. The chip is also suitable for applications requiring high-speed data transfer, such as video streaming and high-speed data acquisition.


In conclusion, the EP4SGX360NF45C3 is a high-performance, low-cost FPGA chip model manufactured by Altera Corporation. It is suitable for a wide range of applications, including high-speed networking, digital signal processing, communications, embedded systems and more. It features a total of 360,000 logic elements and 6.5 million system gates, 4,096 Kbits of embedded memory and a total of 4,096 I/O pins. It has a maximum clock frequency of 300MHz and a total power dissipation of 6.5W.



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