EP4SGX360FF35C3
EP4SGX360FF35C3
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Intel Corporation

EP4SGX360FF35C3


EP4SGX360FF35C3
F18-EP4SGX360FF35C3
Active
IC FPGA 564 I/O 1152FBGA
1152-FBGA (35x35)

EP4SGX360FF35C3 ECAD Model


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EP4SGX360FF35C3 Attributes


Type Description Select
Mfr Intel
Series Stratix® IV GX
Package Tray
Number of LABs/CLBs 14144
Number of Logic Elements/Cells 353600
Total RAM Bits 23105536
Number of I/O 564
Voltage - Supply 0.87V ~ 0.93V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number EP4SGX360

EP4SGX360FF35C3 Datasheet Download


EP4SGX360FF35C3 Overview



The EP4SGX360FF35C3 is an Altera Stratix IV FPGA chip, part of the Stratix IV family of FPGAs. It is a high-performance, low-power FPGA with a capacity of up to 4.2 million logic elements, 360Kbit of embedded RAM, and up to 10.2Gbps of transceiver bandwidth. The chip is designed for high-speed serial communication applications, and its transceiver blocks are optimized for low-power and low-latency operation. The chip also features a hardened triple-speed Ethernet MAC, up to 20 LVDS pairs, and up to 16 PLLs for clock generation and management.


The chip is designed for a wide range of applications, including high-speed networking, video processing, medical imaging, communications, and industrial automation. It is ideal for high-bandwidth applications such as high-speed data acquisition, video streaming, and HD video processing. Its transceiver blocks are also well-suited for applications such as high-speed serial communication, high-speed serial protocols, and high-speed network protocols.


The chip is available in a variety of packages, including the EP4SGX360FF35C3-4FGG484C, which features a 484-ball fine pitch BGA package. The chip is also available in a range of densities, including the EP4SGX360FF35C3-3FGG484C, which features a 384-ball fine pitch BGA package. Both packages feature a 0.8mm pitch, and are designed for easy prototyping and production.


In conclusion, the EP4SGX360FF35C3 is a high-performance, low-power FPGA chip designed for high-speed serial communication applications. It features a hardened triple-speed Ethernet MAC, up to 20 LVDS pairs, and up to 16 PLLs for clock generation and management. It is available in a variety of packages and densities, and is ideal for a wide range of applications, including high-speed networking, video processing, medical imaging, communications, and industrial automation.



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Unit Price: $11,433.60
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Pricing (USD)

QTY Unit Price Ext Price
1+ $10,633.2480 $10,633.2480
10+ $10,518.9120 $105,189.1200
100+ $9,947.2320 $994,723.2000
1000+ $9,375.5520 $4,687,776.0000
10000+ $8,575.2000 $8,575,200.0000
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