
Intel Corporation
EP4SGX360FF35C3
EP4SGX360FF35C3 ECAD Model
EP4SGX360FF35C3 Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Stratix® IV GX | |
Package | Tray | |
Number of LABs/CLBs | 14144 | |
Number of Logic Elements/Cells | 353600 | |
Total RAM Bits | 23105536 | |
Number of I/O | 564 | |
Voltage - Supply | 0.87V ~ 0.93V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 1152-BBGA, FCBGA | |
Supplier Device Package | 1152-FBGA (35x35) | |
Base Product Number | EP4SGX360 |
EP4SGX360FF35C3 Datasheet Download
EP4SGX360FF35C3 Overview
The EP4SGX360FF35C3 is an Altera Stratix IV FPGA chip, part of the Stratix IV family of FPGAs. It is a high-performance, low-power FPGA with a capacity of up to 4.2 million logic elements, 360Kbit of embedded RAM, and up to 10.2Gbps of transceiver bandwidth. The chip is designed for high-speed serial communication applications, and its transceiver blocks are optimized for low-power and low-latency operation. The chip also features a hardened triple-speed Ethernet MAC, up to 20 LVDS pairs, and up to 16 PLLs for clock generation and management.
The chip is designed for a wide range of applications, including high-speed networking, video processing, medical imaging, communications, and industrial automation. It is ideal for high-bandwidth applications such as high-speed data acquisition, video streaming, and HD video processing. Its transceiver blocks are also well-suited for applications such as high-speed serial communication, high-speed serial protocols, and high-speed network protocols.
The chip is available in a variety of packages, including the EP4SGX360FF35C3-4FGG484C, which features a 484-ball fine pitch BGA package. The chip is also available in a range of densities, including the EP4SGX360FF35C3-3FGG484C, which features a 384-ball fine pitch BGA package. Both packages feature a 0.8mm pitch, and are designed for easy prototyping and production.
In conclusion, the EP4SGX360FF35C3 is a high-performance, low-power FPGA chip designed for high-speed serial communication applications. It features a hardened triple-speed Ethernet MAC, up to 20 LVDS pairs, and up to 16 PLLs for clock generation and management. It is available in a variety of packages and densities, and is ideal for a wide range of applications, including high-speed networking, video processing, medical imaging, communications, and industrial automation.
You May Also Be Interested In
2,877 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $10,633.2480 | $10,633.2480 |
10+ | $10,518.9120 | $105,189.1200 |
100+ | $9,947.2320 | $994,723.2000 |
1000+ | $9,375.5520 | $4,687,776.0000 |
10000+ | $8,575.2000 | $8,575,200.0000 |
The price is for reference only, please refer to the actual quotation! |