
Intel Corporation
EP4SGX290NF45C2
EP4SGX290NF45C2 ECAD Model
EP4SGX290NF45C2 Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Stratix® IV GX | |
Package | Tray | |
Number of LABs/CLBs | 11648 | |
Number of Logic Elements/Cells | 291200 | |
Total RAM Bits | 17661952 | |
Number of I/O | 920 | |
Voltage - Supply | 0.87V ~ 0.93V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 1932-BBGA, FCBGA | |
Supplier Device Package | 1932-FBGA, FC (45x45) | |
Base Product Number | EP4SGX290 |
EP4SGX290NF45C2 Datasheet Download
EP4SGX290NF45C2 Overview
The EP4SGX290NF45C2 is a field programmable gate array (FPGA) chip manufactured by Altera Corporation. It is a member of the Stratix IV family of FPGAs. It is based on the 90nm process technology and is designed to provide high performance, low power and reliable operation in a wide range of applications.
The EP4SGX290NF45C2 has a total of 290,000 logic elements, including 4,096 embedded 18x18 multipliers and up to 9.1 million system gates. It also features 4,096 embedded memory blocks, up to 2,048 digital signal processing (DSP) blocks, and up to 1,536 input/output (I/O) pins. The chip has a total power dissipation of 9.1W and a maximum operating temperature of 85°C.
The EP4SGX290NF45C2 is ideal for applications requiring high performance, low power, and reliable operation. It is suitable for a wide range of applications, including industrial automation, medical imaging, video processing, and communications. It is also suitable for use in automotive, aerospace, and defense applications.
The EP4SGX290NF45C2 is available in a variety of packages, including the FineLine BGA, FineLine Flip Chip, and FineLine Flip Chip with Heat Spreader. It is also available in a range of densities, from the low density EP4SGX290NF45C2-2 to the high density EP4SGX290NF45C2-6.
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Pricing (USD)
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