EP4SGX230FF35I3G
EP4SGX230FF35I3G
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rohs

Intel Corporation

EP4SGX230FF35I3G


EP4SGX230FF35I3G
F18-EP4SGX230FF35I3G
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-1152
FBGA-1152

EP4SGX230FF35I3G ECAD Model


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EP4SGX230FF35I3G Attributes


Type Description Select
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 564
Number of Outputs 564
Number of Logic Cells 228000
Number of CLBs 9120
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Organization 9120 CLBS
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-1152
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP4SGX230FF35I3G Datasheet Download


EP4SGX230FF35I3G Overview



The chip model EP4SGX230FF35I3G is a new product that has recently been released on the market. It is a high-performance, low-power field programmable gate array (FPGA) chip that is designed for applications in networking and communications. This chip is based on the latest Intel Stratix 10 architecture and has a wide range of features and capabilities.


The EP4SGX230FF35I3G chip is capable of supporting a variety of applications and technologies, including high-speed networking, high-speed data processing, and advanced security features. It is also capable of providing high-speed data transmission and processing, as well as support for a variety of intelligent applications. This chip is designed to be used in a wide range of applications, from industrial automation to consumer electronics.


In terms of industry trends, the EP4SGX230FF35I3G chip is expected to be used in many different types of applications in the future. It is likely to be used in a variety of intelligent scenarios, such as smart homes and smart cities, as well as in industrial applications. It is also likely to be used in the development of new technologies, such as 5G networks and the Internet of Things.


In order to ensure that the EP4SGX230FF35I3G chip is suitable for use in the various applications and technologies mentioned above, it is important to consider the product description and specific design requirements of the chip. The product description should include information such as the number of pins, the power requirements, the operating temperature range, and the maximum clock frequency. It is also important to consider the actual case studies and precautions that need to be taken when using this chip.


Overall, the EP4SGX230FF35I3G chip is a powerful and versatile chip that can be used in a variety of applications and technologies. It is important to consider the industry trends, the product description and design requirements, and the actual case studies and precautions when using this chip. With the right design and implementation, the EP4SGX230FF35I3G chip can be used to create intelligent and powerful applications in the future.



5,175 In Stock


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Unit Price: $35,630.0636
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Pricing (USD)

QTY Unit Price Ext Price
1+ $33,135.9591 $33,135.9591
10+ $32,779.6585 $327,796.5851
100+ $30,998.1553 $3,099,815.5332
1000+ $29,216.6522 $14,608,326.0760
10000+ $26,722.5477 $26,722,547.7000
The price is for reference only, please refer to the actual quotation!

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