
Intel Corporation
EP4SGX230FF35I3G
EP4SGX230FF35I3G ECAD Model
EP4SGX230FF35I3G Attributes
Type | Description | Select |
---|---|---|
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 564 | |
Number of Outputs | 564 | |
Number of Logic Cells | 228000 | |
Number of CLBs | 9120 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Organization | 9120 CLBS | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP4SGX230FF35I3G Datasheet Download
EP4SGX230FF35I3G Overview
The chip model EP4SGX230FF35I3G is a new product that has recently been released on the market. It is a high-performance, low-power field programmable gate array (FPGA) chip that is designed for applications in networking and communications. This chip is based on the latest Intel Stratix 10 architecture and has a wide range of features and capabilities.
The EP4SGX230FF35I3G chip is capable of supporting a variety of applications and technologies, including high-speed networking, high-speed data processing, and advanced security features. It is also capable of providing high-speed data transmission and processing, as well as support for a variety of intelligent applications. This chip is designed to be used in a wide range of applications, from industrial automation to consumer electronics.
In terms of industry trends, the EP4SGX230FF35I3G chip is expected to be used in many different types of applications in the future. It is likely to be used in a variety of intelligent scenarios, such as smart homes and smart cities, as well as in industrial applications. It is also likely to be used in the development of new technologies, such as 5G networks and the Internet of Things.
In order to ensure that the EP4SGX230FF35I3G chip is suitable for use in the various applications and technologies mentioned above, it is important to consider the product description and specific design requirements of the chip. The product description should include information such as the number of pins, the power requirements, the operating temperature range, and the maximum clock frequency. It is also important to consider the actual case studies and precautions that need to be taken when using this chip.
Overall, the EP4SGX230FF35I3G chip is a powerful and versatile chip that can be used in a variety of applications and technologies. It is important to consider the industry trends, the product description and design requirements, and the actual case studies and precautions when using this chip. With the right design and implementation, the EP4SGX230FF35I3G chip can be used to create intelligent and powerful applications in the future.
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5,175 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $33,135.9591 | $33,135.9591 |
10+ | $32,779.6585 | $327,796.5851 |
100+ | $30,998.1553 | $3,099,815.5332 |
1000+ | $29,216.6522 | $14,608,326.0760 |
10000+ | $26,722.5477 | $26,722,547.7000 |
The price is for reference only, please refer to the actual quotation! |