EP4SGX110DF29I4
EP4SGX110DF29I4
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Intel Corporation

EP4SGX110DF29I4


EP4SGX110DF29I4
F18-EP4SGX110DF29I4
Active
IC FPGA 372 I/O 780FBGA
780-FBGA (29x29)

EP4SGX110DF29I4 ECAD Model


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EP4SGX110DF29I4 Attributes


Type Description Select
Mfr Intel
Series Stratix® IV GX
Package Tray
Number of LABs/CLBs 4224
Number of Logic Elements/Cells 105600
Total RAM Bits 9793536
Number of I/O 372
Voltage - Supply 0.87V ~ 0.93V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-FBGA (29x29)
Base Product Number EP4SGX110

EP4SGX110DF29I4 Datasheet Download


EP4SGX110DF29I4 Overview



The EP4SGX110DF29I4 is an Altera Stratix IV FPGA chip designed for high-speed, high-density applications. This device is a high-performance FPGA with a high-speed transceiver, embedded memory, and logic blocks. It is fabricated in a 45nm process technology and has a total of 110,000 logic elements and 29.4Mb of embedded memory.


The EP4SGX110DF29I4 has 10 transceivers, each with a maximum data rate of 10Gbps and a total of up to 128 transceiver channels. It also has an embedded memory controller with up to four independent memory channels and a total of up to 8Gb of DDR3 memory. The logic blocks are divided into four sections: Logic Cells, Embedded Arrays, Memory Blocks, and Multipliers. The Logic Cells provide up to 10,000 logic elements with two levels of logic and up to 8,192 flip-flops. The Embedded Arrays provide up to 4,800 embedded array blocks with up to 4,096 registers and up to 4,096 multiplexers. The Memory Blocks provide up to 4,096 memory blocks with up to 4,096 RAMs and up to 4,096 ROMs. The Multipliers provide up to 1,024 multipliers with up to 1,024 18x18-bit multipliers.


The EP4SGX110DF29I4 is suitable for a wide range of applications, including high-speed networking, video and image processing, wireless communications, and embedded systems. It is also suitable for high-performance computing and storage applications. This device is ideal for designs requiring high-speed, high-density, and low-power solutions.



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