EP4SE820H35I4N
EP4SE820H35I4N
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Intel Corporation

EP4SE820H35I4N


EP4SE820H35I4N
F18-EP4SE820H35I4N
Active
IC FPGA 744 I/O 1152HBGA
1152-HBGA (42.5x42.5)

EP4SE820H35I4N ECAD Model


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EP4SE820H35I4N Attributes


Type Description Select
Mfr Intel
Series STRATIX® IV E
Package Tray
Number of LABs/CLBs 32522
Number of Logic Elements/Cells 813050
Total RAM Bits 34093056
Number of I/O 744
Voltage - Supply 0.87V ~ 0.93V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-HBGA (42.5x42.5)
Base Product Number EP4SE820

EP4SE820H35I4N Datasheet Download


EP4SE820H35I4N Overview



The EP4SE820H35I4N is an FPGA chip model manufactured by Altera Corporation. It is designed to provide high performance and scalability for a wide range of applications.


The EP4SE820H35I4N is a high-performance, low-power FPGA chip with a total of 8,200 logic elements. It has a total of 35 I/O banks, each with an I/O voltage of 1.8V or 2.5V. It has a total of 4,096 Kbits of embedded memory and a total of 35 dedicated multipliers. It also has a total of 4,096 Kbits of distributed RAM, and a total of 1,024 Kbits of distributed ROM. The chip also features an internal phase-locked loop (PLL) for clock generation and synchronization.


The EP4SE820H35I4N is suitable for a wide range of applications such as digital signal processing, image processing, communication systems, embedded systems, and industrial automation. It is designed to be used in systems with high-speed data transfer and intensive computation requirements. It is also suitable for applications that require low-power consumption and high-performance.


In summary, the EP4SE820H35I4N is a high-performance, low-power FPGA chip with a total of 8,200 logic elements, 35 I/O banks, 4,096 Kbits of embedded memory, 35 dedicated multipliers, 4,096 Kbits of distributed RAM, 1,024 Kbits of distributed ROM, and an internal PLL. It is suitable for a wide range of applications, including digital signal processing, image processing, communication systems, embedded systems, and industrial automation.



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