EP3SL70F780C4L
EP3SL70F780C4L
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

EP3SL70F780C4L


EP3SL70F780C4L
F18-EP3SL70F780C4L
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-780
FBGA-780

EP3SL70F780C4L ECAD Model


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EP3SL70F780C4L Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 488
Number of Outputs 488
Number of Logic Cells 67500
Number of CLBs 2700
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 2700 CLBS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Power Supplies 1.2/3.3 V
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B780
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 29 mm
Length 29 mm
Seated Height-Max 3.2 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-780
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SL70F780C4L Datasheet Download


EP3SL70F780C4L Overview



The EP3SL70F780C4L chip model is a high-performance digital signal processor that is suitable for a variety of applications such as embedded processing, image processing, and more. It is designed to be used with the HDL language, which is a hardware description language used in the design of digital systems.


In terms of industry trends, the EP3SL70F780C4L chip model is well-suited for the modern digital age. As technology continues to advance, the need for high-performance digital signal processors is increasing. The EP3SL70F780C4L chip model is well-positioned to meet these needs, as it is designed to be used with the HDL language which is a powerful tool for designing digital systems.


The product description and design requirements of the EP3SL70F780C4L chip model are quite detailed. It is designed to be used in a variety of applications, including embedded processing, image processing, and more. The chip has a wide range of features, such as a high-speed clock, multiple I/O ports, and a wide range of memory options. It also has a number of built-in functions that can be used to simplify the design process.


To ensure that the EP3SL70F780C4L chip model is used correctly, it is important to understand the design requirements and the application environment. In addition, it is important to consider the specific technologies that are needed to ensure that the chip works correctly. This includes the use of the HDL language, which is necessary for the design of digital systems.


Finally, it is important to consider actual case studies and any precautions that must be taken to ensure that the chip model works correctly. This includes testing the device in a variety of different scenarios to ensure that it is working correctly. It is also important to consider any potential issues that may arise, such as compatibility issues, and to address them before the device is put into use.


In conclusion, the EP3SL70F780C4L chip model is a powerful tool for designing digital systems. It is well-suited for a variety of applications and is designed to be used with the HDL language. It is important to understand the design requirements and the application environment, as well as to consider the specific technologies that are needed to ensure that the chip works correctly. In addition, it is important to consider actual case studies and any precautions that must be taken to ensure that the chip model works correctly.



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Unit Price: $1,048.005
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Pricing (USD)

QTY Unit Price Ext Price
1+ $974.6447 $974.6447
10+ $964.1646 $9,641.6460
100+ $911.7644 $91,176.4350
1000+ $859.3641 $429,682.0500
10000+ $786.0038 $786,003.7500
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