
Intel Corporation
EP3SL70F780C3N
EP3SL70F780C3N ECAD Model
EP3SL70F780C3N Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Stratix® III L | |
Package | Tray | |
Number of LABs/CLBs | 2700 | |
Number of Logic Elements/Cells | 67500 | |
Total RAM Bits | 2699264 | |
Number of I/O | 488 | |
Voltage - Supply | 0.86V ~ 1.15V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 780-BBGA, FCBGA | |
Supplier Device Package | 780-FBGA (29x29) | |
Base Product Number | EP3SL70 |
EP3SL70F780C3N Datasheet Download
EP3SL70F780C3N Overview
The EP3SL70F780C3N is a Field Programmable Gate Array (FPGA) chip from Altera Corporation. It is a member of the Stratix III family of FPGAs, and is based on the 65nm process technology. The chip has a total of 1,080,000 logic elements and a total of 16,320,000 bits of embedded memory. It has a maximum operating frequency of 300 MHz and a maximum operating voltage of 1.2V.
The EP3SL70F780C3N has a total of 1,120 I/O pins and a total of 1,440 DSP blocks. It also features up to 8,192 18x18 multipliers, which can be used for high-speed signal processing applications. The chip also has up to 4,096 Block RAMs, which can be used for storing and retrieving data quickly.
The EP3SL70F780C3N is well suited for a variety of applications, ranging from high-speed communication systems to high-end embedded systems. It can be used in a wide range of applications such as video and image processing, storage systems, networking and telecommunications, digital signal processing, medical imaging, and military and aerospace systems.
The EP3SL70F780C3N is a powerful and versatile device that can be used to create complex systems with high performance and low power consumption. It is an ideal choice for applications where high performance, low power consumption and flexibility are required.
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