EP3SL70F780C3G
EP3SL70F780C3G
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Intel Corporation

EP3SL70F780C3G


EP3SL70F780C3G
F18-EP3SL70F780C3G
Active
IC FPGA 488 I/O 780FBGA
780-FBGA (29x29)

EP3SL70F780C3G ECAD Model


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EP3SL70F780C3G Attributes


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EP3SL70F780C3G Overview



The chip model EP3SL70F780C3G is an advanced and powerful integrated circuit (IC) that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, image processing, and more. This IC is designed to require the use of HDL language, which is a hardware description language that is used to design and simulate digital logic circuits.


The EP3SL70F780C3G chip model offers numerous advantages over other ICs, such as high speed, low power consumption, and a high level of integration. This allows for the production of more efficient, reliable, and cost-effective products. Furthermore, the chip model is also known for its flexibility, as it can be tailored to meet the specific needs of different applications.


In the future, the demand for the EP3SL70F780C3G chip model is expected to increase in various industries, such as automotive, medical, and consumer electronics. This is due to the IC’s ability to provide reliable and efficient performance, as well as its flexibility and adaptability to different applications.


When designing with the EP3SL70F780C3G chip model, it is important to consider the specific design requirements of the application. These include the power supply voltage, the number of I/O pins, and the clock speed. Additionally, it is important to consider the environment in which the chip will be used, as this can affect the performance of the IC.


When using the EP3SL70F780C3G chip model, there are a few precautions to keep in mind. For example, it is important to ensure that the necessary software and hardware is compatible with the chip model, as this can affect the performance and reliability of the product. Additionally, it is important to be aware of the power requirements of the chip model, as this can affect the power consumption and cost of the product.


To illustrate the use of the EP3SL70F780C3G chip model, there are several case studies that can be used as reference. These include the design of a medical device, a consumer electronics product, and a high-performance digital signal processor. By studying these case studies, designers can gain a better understanding of the capabilities and limitations of the chip model.


In conclusion, the EP3SL70F780C3G chip model is an advanced and powerful IC that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, image processing, and more. This IC offers numerous advantages, such as high speed, low power consumption, and a high level of integration. Furthermore, the demand for the chip model is expected to increase in the future, as it can provide reliable and efficient performance for a variety of applications. When designing with the chip model, it is important to consider the specific design requirements, as well as the environment in which the chip will be used. Additionally, there are a few precautions to keep in mind when using the chip model. Finally, there are several case studies that can be used as reference when designing with the chip model.



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Unit Price: $4,977.7103
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,629.2706 $4,629.2706
10+ $4,579.4935 $45,794.9348
100+ $4,330.6080 $433,060.7961
1000+ $4,081.7224 $2,040,861.2230
10000+ $3,733.2827 $3,733,282.7250
The price is for reference only, please refer to the actual quotation!

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