Intel Corporation
EP3SL70F780C2
EP3SL70F780C2 ECAD Model
EP3SL70F780C2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 67500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 800 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL70F780C2 Datasheet Download
EP3SL70F780C2 Overview
The chip model EP3SL70F780C2 is a high-performance, low-power and cost-effective FPGA chip with a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It is based on the Altera Stratix III FPGA architecture and requires the use of HDL language for programming.
The original design intention of the chip model EP3SL70F780C2 was to provide a low-cost and low-power solution for high-performance FPGA applications. The chip model has a wide range of features, such as high-speed DSP blocks, embedded memory, and logic elements, which can be used to develop and implement complex digital signal processing and embedded processing applications. It also has the capability to be upgraded in the future, with the possibility of adding additional features and capabilities.
The chip model EP3SL70F780C2 can also be applied to advanced communication systems, providing an efficient and low-cost solution for communication-related tasks. It has the capability to process large amounts of data in a short amount of time, making it suitable for use in advanced communication systems.
The chip model EP3SL70F780C2 can also be used in the development and popularization of future intelligent robots. It has the capability to process large amounts of data quickly and accurately, making it a suitable choice for use in the development of intelligent robots. To use the chip model effectively, technical talents such as software engineers, electrical engineers, and computer scientists are needed. They should have a strong understanding of HDL language and the FPGA architecture, as well as the capability to program and design complex digital systems.
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4,172 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,098.3308 | $1,098.3308 |
| 10+ | $1,086.5208 | $10,865.2083 |
| 100+ | $1,027.4708 | $102,747.0783 |
| 1000+ | $968.4207 | $484,210.3690 |
| 10000+ | $885.7507 | $885,750.6750 |
| The price is for reference only, please refer to the actual quotation! | ||