Intel Corporation
EP3SL70F484C4LN
EP3SL70F484C4LN ECAD Model
EP3SL70F484C4LN Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 296 | |
| Number of Outputs | 296 | |
| Number of Logic Cells | 67500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-484 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL70F484C4LN Datasheet Download
EP3SL70F484C4LN Overview
The EP3SL70F484C4LN chip model is a high-performance chip designed for digital signal processing, embedded processing, and image processing. It is equipped with a high-speed logic core, a high-speed memory, and a large-capacity storage, making it ideal for high-performance computing applications. This chip model is designed to be used with the HDL language, which makes it easy to develop complex algorithms and applications.
The EP3SL70F484C4LN chip model has a number of advantages over its competitors. It is capable of handling a large amount of data in a short amount of time, making it ideal for applications that require high-speed computing. It also has a low power consumption, making it more energy-efficient than other models. Furthermore, it is highly reliable, making it a great choice for applications that require consistent performance.
The EP3SL70F484C4LN chip model is expected to be in high demand in the future due to its high performance and low power consumption. It is likely to be used in a variety of applications, from embedded processing to image processing. It is also likely to be used in networking applications, as it is capable of handling large amounts of data quickly and reliably.
The EP3SL70F484C4LN chip model is also likely to be used in intelligent scenarios, such as machine learning and artificial intelligence. It is capable of processing large amounts of data quickly, making it well-suited for these applications. It is also likely to be used in the era of fully intelligent systems, as it is capable of handling complex algorithms and applications.
Overall, the EP3SL70F484C4LN chip model is a powerful and reliable chip model that is ideal for high-performance digital signal processing, embedded processing, image processing, and more. Its low power consumption and high performance make it a great choice for a variety of applications. It is also likely to be in high demand in the future, as it is capable of handling complex algorithms and applications in the era of fully intelligent systems.
You May Also Be Interested In
1,867 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $816.5458 | $816.5458 |
| 10+ | $807.7657 | $8,077.6570 |
| 100+ | $763.8654 | $76,386.5394 |
| 1000+ | $719.9651 | $359,982.5420 |
| 10000+ | $658.5047 | $658,504.6500 |
| The price is for reference only, please refer to the actual quotation! | ||