EP3SL70F484C4L
EP3SL70F484C4L
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

EP3SL70F484C4L


EP3SL70F484C4L
F18-EP3SL70F484C4L
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-484
FBGA-484

EP3SL70F484C4L ECAD Model


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EP3SL70F484C4L Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 296
Number of Outputs 296
Number of Logic Cells 67500
Number of CLBs 2700
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 2700 CLBS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Power Supplies 1.2/3.3 V
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 3.2 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-484
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SL70F484C4L Datasheet Download


EP3SL70F484C4L Overview



The chip model EP3SL70F484C4L is a powerful semiconductor device that has been developed by Altera Corporation, a leading provider of programmable logic solutions. This chip model is designed to provide a high performance, low power solution for a variety of applications. It is a versatile device that can be used in a wide range of applications, such as industrial control, automotive, consumer electronics, and communications.


The EP3SL70F484C4L chip model is equipped with a high-performance embedded processor core, a high-speed memory controller, and a wide range of peripherals. It also supports a variety of communication protocols, such as Ethernet, USB, and CAN. This makes it ideal for applications that require high-speed data transfer and real-time response.


In terms of industry trends, the EP3SL70F484C4L chip model is expected to be widely used in the future, as it is able to meet the demands of the current and future networks and intelligent scenarios. It is a highly versatile device that can be used in a variety of applications, such as industrial control, automotive, consumer electronics, and communications. Moreover, the chip model is designed to be used in the era of fully intelligent systems, and it can be used to support the development of new technologies.


In terms of product description and design requirements, the EP3SL70F484C4L chip model is made up of a high-performance embedded processor core, a high-speed memory controller, and a wide range of peripherals. It is designed to provide a low-power solution for a variety of applications. It is also designed to be compatible with a wide range of communication protocols, such as Ethernet, USB, and CAN.


In terms of actual case studies and precautions, the EP3SL70F484C4L chip model has been used in a variety of applications, such as industrial control, automotive, consumer electronics, and communications. It has been tested in a variety of scenarios and has been found to be reliable and efficient. However, it is important to note that the chip model should be used in accordance with the manufacturer’s instructions and recommendations. Moreover, it is important to ensure that the chip model is used in the correct environment and that it is compatible with the application.


In conclusion, the EP3SL70F484C4L chip model is a powerful and versatile device that can be used in a variety of applications. It is designed to provide a high performance, low power solution for a variety of applications. It is also designed to be used in the era of fully intelligent systems, and it can be used to support the development of new technologies. Moreover, it is important to ensure that the chip model is used in the correct environment and that it is compatible with the application.



5,470 In Stock


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Unit Price: $966.0012
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $898.3811 $898.3811
10+ $888.7211 $8,887.2110
100+ $840.4210 $84,042.1044
1000+ $792.1210 $396,060.4920
10000+ $724.5009 $724,500.9000
The price is for reference only, please refer to the actual quotation!

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