Intel Corporation
EP3SL70F484C4
EP3SL70F484C4 ECAD Model
EP3SL70F484C4 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 296 | |
| Number of Outputs | 296 | |
| Number of Logic Cells | 67500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-484 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL70F484C4 Datasheet Download
EP3SL70F484C4 Overview
The chip model EP3SL70F484C4 is a key component of the semiconductor industry, and its development is closely related to the future development of related industries. As technology advances, the chip model EP3SL70F484C4 is expected to be more widely used in various scenarios.
The original design intention of EP3SL70F484C4 is to provide a high-speed, low-power, and low-cost solution for digital signal processing and communication systems. It is equipped with an embedded ARM processor core, a high-speed memory controller, and a high-speed interface controller. With its powerful features, EP3SL70F484C4 can support a variety of digital signal processing and communication applications.
In terms of future upgrades, EP3SL70F484C4 is expected to be more powerful, as the semiconductor industry continues to move forward. It is likely to be equipped with more powerful processors, more advanced memory controllers, and higher-speed interfaces. This will allow EP3SL70F484C4 to be used in more advanced communication systems and networks.
EP3SL70F484C4 can be applied to various intelligent scenarios, such as smart home systems, autonomous driving, and industrial automation. With its powerful features, EP3SL70F484C4 can provide a reliable and efficient solution for these intelligent scenarios. Moreover, as the era of fully intelligent systems is coming, EP3SL70F484C4 can be used to support the development of these systems.
In conclusion, the chip model EP3SL70F484C4 is a key component of the semiconductor industry and its development is closely related to the future development of related industries. It has a powerful feature set and can be applied to various intelligent scenarios. With the advancement of technology, EP3SL70F484C4 is expected to be more powerful and can be used to support the development of fully intelligent systems.
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1,818 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $599.8525 | $599.8525 |
| 10+ | $593.4025 | $5,934.0248 |
| 100+ | $561.1523 | $56,115.2349 |
| 1000+ | $528.9022 | $264,451.1070 |
| 10000+ | $483.7520 | $483,752.0250 |
| The price is for reference only, please refer to the actual quotation! | ||