Intel Corporation
EP3SL70F484C2N
EP3SL70F484C2N ECAD Model
EP3SL70F484C2N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 296 | |
| Number of Outputs | 296 | |
| Number of Logic Cells | 67500 | |
| Number of CLBs | 2700 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 2700 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 3.2 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-484 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL70F484C2N Datasheet Download
EP3SL70F484C2N Overview
The EP3SL70F484C2N is a powerful chip model that is suitable for a range of high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be used with HDL language, which allows for a high degree of flexibility and scalability. It is an excellent choice for applications that require a high degree of precision and performance.
The EP3SL70F484C2N has numerous advantages compared to other chip models. It has a high-speed processor, a large memory capacity, and a low power consumption. It also has a high level of integration, which allows for the integration of multiple components into a single chip. Additionally, the EP3SL70F484C2N is designed to be compatible with a wide range of operating systems, making it an excellent choice for many applications.
The EP3SL70F484C2N is expected to be in high demand in the future, as it is suitable for a variety of applications. It can be used in networks, as well as in image processing, embedded processing, and digital signal processing applications. It is also likely to be used in intelligent scenarios, such as the development of autonomous systems and robotics. Additionally, the EP3SL70F484C2N is expected to be an important component of the future of fully intelligent systems.
Overall, the EP3SL70F484C2N is an excellent choice for a variety of applications, and is expected to be in high demand in the future. It is suitable for applications such as networks, image processing, embedded processing, and digital signal processing. Additionally, it is expected to be an important component of the future of fully intelligent systems. With its high performance, low power consumption, and high level of integration, the EP3SL70F484C2N is a powerful chip model that is sure to be in high demand in the years to come.
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2,626 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $920.7033 | $920.7033 |
| 10+ | $910.8033 | $9,108.0331 |
| 100+ | $861.3031 | $86,130.3132 |
| 1000+ | $811.8030 | $405,901.4760 |
| 10000+ | $742.5027 | $742,502.7000 |
| The price is for reference only, please refer to the actual quotation! | ||