Intel Corporation
EP3SL70F484C2
EP3SL70F484C2 ECAD Model
EP3SL70F484C2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 296 | |
| Number of Outputs | 296 | |
| Number of Logic Cells | 67500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 800 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-484 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL70F484C2 Datasheet Download
EP3SL70F484C2 Overview
The chip model EP3SL70F484C2 is one of the most advanced and powerful programmable logic devices available in the market today. It is a high-performance device that is ideal for high-performance digital signal processing, embedded processing, image processing, and other related applications. The device is based on a hard-wired logic platform and requires the use of HDL language for programming.
The EP3SL70F484C2 is designed to provide high performance and scalability, as well as a low power consumption rate. It has a built-in memory controller, which allows for faster and more efficient data processing. It also provides a wide range of options for customization, including the use of multiple clock frequencies and a variety of I/O options. The device also supports the latest communication protocols, such as USB 3.0, Ethernet, and Wi-Fi.
The EP3SL70F484C2 is designed to meet the needs of today's high-performance applications. It has a wide range of features, including high-speed data processing, low power consumption, and flexible customization options. This makes it an ideal choice for applications such as medical imaging, industrial automation, and embedded systems.
The original design intention of the chip model EP3SL70F484C2 is to provide a powerful and reliable platform for high-performance applications. The device is designed to be scalable and customizable, allowing it to be used in a variety of applications. It also has a low power consumption rate, which makes it an ideal choice for applications where power efficiency is important.
The EP3SL70F484C2 is expected to see an increase in demand in the future, as more applications require a powerful and reliable platform. The device is also expected to be used in more advanced communication systems, as the technology continues to evolve. The device is also capable of being upgraded in the future, allowing it to keep up with the latest advancements in technology. This makes it an ideal choice for applications that require a powerful and reliable platform.
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2,654 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,012.7732 | $1,012.7732 |
| 10+ | $1,001.8831 | $10,018.8313 |
| 100+ | $947.4330 | $94,743.2958 |
| 1000+ | $892.9828 | $446,491.3940 |
| 10000+ | $816.7526 | $816,752.5500 |
| The price is for reference only, please refer to the actual quotation! | ||