Intel Corporation
EP3SL50F780C4L
EP3SL50F780C4L ECAD Model
EP3SL50F780C4L Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 47500 | |
| Number of CLBs | 1900 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 1900 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.2 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL50F780C4L Datasheet Download
EP3SL50F780C4L Overview
The chip model EP3SL50F780C4L is an advanced technology designed for high-performance digital signal processing, embedded processing, and image processing. It is a powerful tool that requires the use of HDL language to program and configure the device. This chip model is a great choice for those looking to build or upgrade their current system.
The future of the chip model EP3SL50F780C4L and related industries depend on what specific technologies are needed. As technology advances, so does the need for new technologies and applications. The chip model EP3SL50F780C4L can be used to develop and popularize future intelligent robots, but it requires the right technical talents to use the model effectively.
The chip model EP3SL50F780C4L is an ideal choice for those looking for a powerful and efficient system for digital signal processing, embedded processing, and image processing. The chip model is capable of running complex algorithms and can be programmed and configured using HDL language. This makes the chip model an excellent choice for those who are looking to build or upgrade their current system.
In terms of future development, the chip model EP3SL50F780C4L can be used to develop and popularize future intelligent robots. However, it requires the right technical talents to use the model effectively. Technical experts who are knowledgeable in HDL language and have experience in programming and configuring the chip model are essential for the successful development and deployment of these robots.
In conclusion, the chip model EP3SL50F780C4L is an ideal choice for those looking for a powerful and efficient system for digital signal processing, embedded processing, and image processing. The chip model is capable of running complex algorithms and can be programmed and configured using HDL language. Furthermore, the chip model can be used to develop and popularize future intelligent robots, but it requires the right technical talents to use the model effectively.
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2,332 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $618.9146 | $618.9146 |
| 10+ | $612.2596 | $6,122.5963 |
| 100+ | $578.9847 | $57,898.4652 |
| 1000+ | $545.7097 | $272,854.8360 |
| 10000+ | $499.1247 | $499,124.7000 |
| The price is for reference only, please refer to the actual quotation! | ||