Intel Corporation
EP3SL50F484C3
EP3SL50F484C3 ECAD Model
EP3SL50F484C3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 296 | |
| Number of Outputs | 296 | |
| Number of Logic Cells | 47500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-484 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL50F484C3 Datasheet Download
EP3SL50F484C3 Overview
The EP3SL50F484C3 chip model is a highly advanced integrated circuit (IC) designed for use in high-performance digital signal processing, embedded processing, and image processing applications. It is based on the Intel® Stratix® III FPGA architecture, which enables the user to program the chip using the Hardware Description Language (HDL). The EP3SL50F484C3 chip model is designed to provide a high degree of flexibility and scalability, allowing it to be used in a variety of applications.
The EP3SL50F484C3 chip model is designed to provide high-speed digital signal processing, embedded processing, and image processing capabilities. It is capable of performing a wide range of tasks, including high-speed data acquisition, real-time signal analysis, and image processing. The chip model also provides the capability to easily upgrade and expand its capabilities. This allows users to customize the chip model to meet their specific needs and requirements.
The EP3SL50F484C3 chip model is designed to provide a high degree of flexibility and scalability, making it ideal for use in advanced communication systems. It is capable of handling high-speed data rates, making it suitable for use in a wide range of applications. The chip model also provides the capability to easily upgrade and expand its capabilities, allowing users to customize the chip model to meet their specific needs and requirements.
The EP3SL50F484C3 chip model is designed to provide a high degree of flexibility and scalability, allowing it to be used in a variety of applications. It is capable of performing a wide range of tasks, including high-speed data acquisition, real-time signal analysis, and image processing. The chip model also provides the capability to easily upgrade and expand its capabilities, allowing users to customize the chip model to meet their specific needs and requirements.
When designing with the EP3SL50F484C3 chip model, it is important to consider the product description and specific design requirements. It is important to ensure that the design meets the requirements of the application and that the design is optimized for the best performance. Additionally, it is important to consider the actual case studies and precautions when designing with the chip model.
In conclusion, the EP3SL50F484C3 chip model is a highly advanced integrated circuit (IC) designed for use in high-performance digital signal processing, embedded processing, and image processing applications. It is based on the Intel® Stratix® III FPGA architecture, which enables the user to program the chip using the Hardware Description Language (HDL). The chip model is designed to provide a high degree of flexibility and scalability, allowing it to be used in a variety of applications. Additionally, the chip model is capable of handling high-speed data rates, making it suitable for use in advanced communication systems. When designing with the EP3SL50F484C3 chip model, it is important to consider the product description and specific design requirements, as well as actual case studies and precautions.
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3,987 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $470.5820 | $470.5820 |
| 10+ | $465.5220 | $4,655.2202 |
| 100+ | $440.2219 | $44,022.1914 |
| 1000+ | $414.9218 | $207,460.9020 |
| 10000+ | $379.5017 | $379,501.6500 |
| The price is for reference only, please refer to the actual quotation! | ||