Intel Corporation
EP3SL50F484C2N
EP3SL50F484C2N ECAD Model
EP3SL50F484C2N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 296 | |
| Number of Outputs | 296 | |
| Number of Logic Cells | 47500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 800 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA484,22X22,40 | |
| Pin Count | 484 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL50F484C2N Overview
The chip model EP3SL50F484C2N is a powerful and reliable semiconductor device that is suitable for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a hardware description language that enables the design of complex digital systems.
In the current market, the EP3SL50F484C2N is widely used in industrial applications, such as process control, robotics, and digital communications. With the development of technology, the chip model EP3SL50F484C2N is expected to be used in more advanced applications, such as networks and intelligent systems. For example, it can be used for the development of sophisticated artificial intelligence systems, machine learning, and autonomous systems.
In terms of the future development of related industries, the EP3SL50F484C2N may be required to support new technologies. This is because the chip model is expected to be used in the era of fully intelligent systems, which require the support of technologies such as 5G, cloud computing, and edge computing. These technologies will enable the chip model to be used in more sophisticated applications, such as self-driving cars and smart home systems.
In addition, the EP3SL50F484C2N may also be used in networks, such as the Internet of Things (IoT). This is because the chip model is capable of processing large amounts of data at high speeds, which makes it ideal for applications such as data analytics and real-time monitoring. Furthermore, the chip model is also suitable for intelligent scenarios, such as facial recognition, natural language processing, and image recognition.
Overall, the chip model EP3SL50F484C2N is a powerful and reliable semiconductor device that is suitable for a wide range of applications. It is expected to be used in more advanced applications, such as networks and intelligent systems, and may require the support of new technologies. The chip model is capable of processing large amounts of data at high speeds, making it ideal for applications such as data analytics and real-time monitoring, as well as intelligent scenarios, such as facial recognition, natural language processing, and image recognition.
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3,458 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||