Intel Corporation
EP3SL50F484C2
EP3SL50F484C2 ECAD Model
EP3SL50F484C2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 296 | |
| Number of Outputs | 296 | |
| Number of Logic Cells | 47500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 800 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-484 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL50F484C2 Datasheet Download
EP3SL50F484C2 Overview
The chip model EP3SL50F484C2 is a high-performance, low-power processor designed for digital signal processing, embedded processing, and image processing. It is created using the advanced HDL language, which allows for the development of powerful applications with minimal effort. The EP3SL50F484C2 is a reliable and cost-effective solution for those looking to reduce development time and cost while still achieving high performance.
The EP3SL50F484C2 is ideal for applications such as medical imaging, audio processing, and video processing. It is also suitable for automotive, industrial, and consumer applications. The EP3SL50F484C2 is designed to be used in a variety of environments, including high-temperature, low-power, and low-latency. The chip model is designed to provide reliable performance in a variety of conditions.
The EP3SL50F484C2 is expected to be in high demand in the future, as more applications are developed to take advantage of its powerful features. With the increasing demand for embedded processing, digital signal processing, and image processing, the EP3SL50F484C2 is expected to be a key component in many applications in the future. The chip model is also expected to be used in the development of intelligent robots, as it can provide the necessary processing power and reliability.
To use the EP3SL50F484C2 effectively, technical talents with knowledge of HDL language are required. This language is used to create the applications that will take advantage of the chip model's features. Those with a deep understanding of the language will be able to develop powerful applications with minimal effort. Additionally, technical talents with knowledge of embedded processing, digital signal processing, and image processing are also necessary to effectively use the chip model.
In conclusion, the EP3SL50F484C2 is a powerful and reliable chip model that is suitable for a variety of applications. It is expected to be in high demand in the future, and will be a key component in the development of intelligent robots. To use the chip model effectively, technical talents with knowledge of HDL language and embedded processing, digital signal processing, and image processing are required.
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5,478 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $611.9429 | $611.9429 |
| 10+ | $605.3629 | $6,053.6285 |
| 100+ | $572.4627 | $57,246.2697 |
| 1000+ | $539.5625 | $269,781.2710 |
| 10000+ | $493.5023 | $493,502.3250 |
| The price is for reference only, please refer to the actual quotation! | ||