
Intel Corporation
EP3SL340F1760I3G
EP3SL340F1760I3G ECAD Model
EP3SL340F1760I3G Attributes
Type | Description | Select |
---|---|---|
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 1120 | |
Number of Outputs | 1120 | |
Number of Logic Cells | 337500 | |
Number of CLBs | 13500 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Organization | 13500 CLBS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B1760 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1760,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.55 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1760 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SL340F1760I3G Datasheet Download
EP3SL340F1760I3G Overview
The EP3SL340F1760I3G chip model is a powerful and versatile tool for modern digital signal processing, embedded processing, and image processing applications. It is designed to be used with HDL (Hardware Description Language) to create sophisticated, high-performance systems.
The EP3SL340F1760I3G chip model has the potential to be applied to a variety of network and intelligent scenarios. It can be used to develop and deploy sophisticated, highly intelligent systems. It can also be used in the development of future intelligent robots, such as autonomous vehicles, drones, and robots that can interact with humans.
The EP3SL340F1760I3G chip model requires a certain level of technical expertise to be used effectively. Engineers and developers must have a good understanding of HDL programming, hardware design, and system-level architectures. Additionally, they must have an understanding of the specific application they are working with and the specific performance requirements.
In conclusion, the EP3SL340F1760I3G chip model is a powerful and versatile tool for modern digital signal processing, embedded processing, and image processing applications. It has the potential to be applied to a variety of network and intelligent scenarios, and can be used to develop and deploy sophisticated, highly intelligent systems. However, it requires a certain level of technical expertise to be used effectively.
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3,440 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $82,284.1381 | $82,284.1381 |
10+ | $81,399.3625 | $813,993.6247 |
100+ | $76,975.4841 | $7,697,548.4073 |
1000+ | $72,551.6057 | $36,275,802.8390 |
10000+ | $66,358.1759 | $66,358,175.9250 |
The price is for reference only, please refer to the actual quotation! |