
Intel Corporation
EP3SL340F1760I3
EP3SL340F1760I3 ECAD Model
EP3SL340F1760I3 Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Stratix® III L | |
Package | Tray | |
Number of LABs/CLBs | 13500 | |
Number of Logic Elements/Cells | 337500 | |
Total RAM Bits | 18822144 | |
Number of I/O | 1120 | |
Voltage - Supply | 0.86V ~ 1.15V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 1760-BBGA, FCBGA | |
Supplier Device Package | 1760-FCBGA (42.5x42.5) | |
Base Product Number | EP3SL340 |
EP3SL340F1760I3 Datasheet Download
EP3SL340F1760I3 Overview
The EP3SL340F1760I3 chip is a high-performance, low-power, low-cost FPGA solution developed by Altera, a leading semiconductor company. This chip model is designed to provide a complete system-on-chip (SoC) solution for a variety of applications.
The EP3SL340F1760I3 chip features a high-performance, low-power, low-cost FPGA with a total of 1760 logic elements, including 16Kbits of embedded RAM and 8Kbits of distributed RAM. It also includes a wide variety of I/O options, including LVDS, LVCMOS, and differential I/O. The device also includes a high-speed transceiver for high-speed data communication and a powerful DSP block for signal processing.
The EP3SL340F1760I3 chip is ideal for applications such as industrial automation, medical imaging, automotive, aerospace, and defense. It is also suitable for applications such as high-performance computing, communication, and networking. The chip is also suitable for applications that require high-speed data communication, such as high-speed serial communications and high-speed video processing.
The EP3SL340F1760I3 chip is also suitable for applications that require a low-power, low-cost FPGA solution. It is designed to provide a low-cost, low-power, and high-performance solution that is ideal for embedded applications.
In conclusion, the EP3SL340F1760I3 chip is a high-performance, low-power, low-cost FPGA solution that is suitable for a variety of applications. It is ideal for industrial automation, medical imaging, automotive, aerospace, and defense applications, as well as for high-performance computing, communication, and networking applications. It is also suitable for applications that require high-speed data communication, such as high-speed serial communications and high-speed video processing.
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