Intel Corporation
EP3SL340F1760C2G
EP3SL340F1760C2G ECAD Model
EP3SL340F1760C2G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 1120 | |
| Number of Outputs | 1120 | |
| Number of Logic Cells | 337500 | |
| Number of CLBs | 13500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 13500 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1760 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1760,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.55 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1760 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL340F1760C2G Datasheet Download
EP3SL340F1760C2G Overview
The chip model EP3SL340F1760C2G is a cutting-edge technology designed to provide reliable and high-performance solutions for advanced communication systems. Developed by Intel, this chip is part of their Stratix III family of FPGAs and is designed to provide a high-performance, low-power solution for a variety of applications.
The EP3SL340F1760C2G is a high-performance FPGA with a large number of configurable logic blocks, embedded memory blocks, and specialized high-speed transceivers. It is designed to provide a low-cost, low-power solution for applications requiring high-speed communication and high-performance computing. The chip is capable of supporting a wide range of communication protocols, including Ethernet, USB, and PCI Express.
In terms of industry trends, the EP3SL340F1760C2G is designed to meet the needs of the most demanding applications. It is capable of supporting a wide range of communication protocols, including Ethernet, USB, and PCI Express, making it suitable for a variety of applications. The chip also supports advanced signal processing, such as signal integrity and equalization, which is critical for high-speed communication systems.
In terms of future development, the EP3SL340F1760C2G is designed to be upgradeable. Its architecture allows for the addition of new features and capabilities, such as increased memory and increased performance. This makes it ideal for applications that require high-speed communication and high-performance computing. Additionally, the chip is designed to be compatible with a variety of operating systems, making it an ideal choice for applications that require a wide range of compatibility.
When it comes to the product description and specific design requirements of the EP3SL340F1760C2G, the chip is designed to meet the needs of the most demanding applications. It is designed to provide reliable and high-performance solutions for advanced communication systems, with a large number of configurable logic blocks, embedded memory blocks, and specialized high-speed transceivers. Additionally, the chip is designed to be upgradeable, allowing for the addition of new features and capabilities.
When considering actual case studies and precautions, the EP3SL340F1760C2G is designed to meet the needs of the most demanding applications. It is designed to provide reliable and high-performance solutions for advanced communication systems, with a large number of configurable logic blocks, embedded memory blocks, and specialized high-speed transceivers. Additionally, the chip is designed to be compatible with a variety of operating systems, making it an ideal choice for applications that require a wide range of compatibility.
In conclusion, the EP3SL340F1760C2G is a cutting-edge technology designed to provide reliable and high-performance solutions for advanced communication systems. It is designed to meet the needs of the most demanding applications, with a large number of configurable logic blocks, embedded memory blocks, and specialized high-speed transceivers. Additionally, the chip is designed to be upgradeable, allowing for the addition of new features and capabilities, as well as compatibility with a variety of operating systems. With these features, the EP3SL340F1760C2G is an ideal choice for applications that require a wide range of compatibility and high-speed communication.
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4,922 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $24,868.9440 | $24,868.9440 |
| 10+ | $24,601.5360 | $246,015.3600 |
| 100+ | $23,264.4960 | $2,326,449.6000 |
| 1000+ | $21,927.4560 | $10,963,728.0000 |
| 10000+ | $20,055.6000 | $20,055,600.0000 |
| The price is for reference only, please refer to the actual quotation! | ||