
Intel Corporation
EP3SL340F1517C2G
EP3SL340F1517C2G ECAD Model
EP3SL340F1517C2G Attributes
Type | Description | Select |
---|---|---|
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 976 | |
Number of Outputs | 976 | |
Number of Logic Cells | 337500 | |
Number of CLBs | 13500 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 13500 CLBS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1517 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SL340F1517C2G Datasheet Download
EP3SL340F1517C2G Overview
The chip model EP3SL340F1517C2G is a highly advanced and powerful integrated circuit designed to meet the needs of today's complex and rapidly evolving networked systems. Developed by Altera, this chip model is designed to provide a wide range of features, including high-speed data processing, low power consumption, and support for multiple operating systems.
The EP3SL340F1517C2G chip model is designed to provide a high performance, low power solution for a variety of applications. It is capable of supporting a wide range of data transfer rates and is able to handle large amounts of data quickly and efficiently. The chip also features a number of features that make it suitable for use in a variety of networked environments. These features include support for multiple operating systems, support for multiple protocols, and support for a wide range of security protocols.
In addition to its high performance and low power consumption, the EP3SL340F1517C2G chip model is also designed to provide a wide range of features that make it suitable for use in a variety of networked environments. These features include support for multiple operating systems, support for multiple protocols, and support for a wide range of security protocols. This makes the chip model suitable for use in a variety of intelligent scenarios, such as in the Internet of Things (IoT) and in the era of fully intelligent systems.
The EP3SL340F1517C2G chip model is also designed to provide a wide range of design requirements, including support for a wide range of data transfer rates, support for multiple operating systems, support for multiple protocols, and support for a wide range of security protocols. In addition, the chip model is also designed to provide a wide range of features that make it suitable for use in a variety of networked environments. This includes support for a wide range of data transfer rates, support for multiple operating systems, support for multiple protocols, and support for a wide range of security protocols.
In order to ensure that the EP3SL340F1517C2G chip model is suitable for use in a variety of networked environments, it is important to consider the industry trends of the chip model and the future development of related industries. This includes considering the possible future applications of the chip model in networks and which intelligent scenarios it may be applied to, as well as whether it is possible to be used in the era of fully intelligent systems. It is also important to consider the product description and specific design requirements of the chip model, along with actual case studies and precautions.
In conclusion, the EP3SL340F1517C2G chip model is a highly advanced and powerful integrated circuit designed to meet the needs of today's complex and rapidly evolving networked systems. It is capable of supporting a wide range of features, including high-speed data processing, low power consumption, and support for multiple operating systems. It is also important to consider the industry trends of the chip model and the future development of related industries, as well as the possible future applications of the chip model in networks and which intelligent scenarios it may be applied to. In addition, it is important to consider the product description and specific design requirements of the chip model, along with actual case studies and precautions.
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3,964 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $80,411.8944 | $80,411.8944 |
10+ | $79,547.2504 | $795,472.5039 |
100+ | $75,224.0303 | $7,522,403.0262 |
1000+ | $70,900.8101 | $35,450,405.0660 |
10000+ | $64,848.3020 | $64,848,301.9500 |
The price is for reference only, please refer to the actual quotation! |