Intel Corporation
EP3SL200H780I4LG
EP3SL200H780I4LG ECAD Model
EP3SL200H780I4LG Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Logic Cells | 200000 | |
| Number of CLBs | 8000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 8000 CLBS | |
| Additional Feature | ALSO OPERATES AT 1.1V VCC NOMINAL | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 33 mm | |
| Length | 33 mm | |
| Seated Height-Max | 3.2 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | HBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL200H780I4LG Datasheet Download
EP3SL200H780I4LG Overview
The chip model EP3SL200H780I4LG has been designed for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language and is suitable for a variety of applications. This chip has become increasingly popular in recent years due to its performance and versatility.
The industry trends of the chip model EP3SL200H780I4LG are constantly evolving, and the future development of related industries will heavily depend on the specific technologies needed. It is likely that the chip model EP3SL200H780I4LG will be used in networks and intelligent scenarios, and its application environment may require the support of new technologies. With the development of artificial intelligence and the emergence of fully intelligent systems, the chip model EP3SL200H780I4LG may also be used in such an environment.
In order to ensure the chip model EP3SL200H780I4LG is able to meet the demands of the future, its designers must keep up with the latest industry trends and technologies. This includes researching and developing new technologies that can be used to improve the performance of the chip model EP3SL200H780I4LG. In addition, the chip model EP3SL200H780I4LG must remain compatible with the latest industry standards.
The chip model EP3SL200H780I4LG is a versatile and powerful tool that can be used in a variety of applications. With the development of new technologies and the emergence of fully intelligent systems, the chip model EP3SL200H780I4LG is likely to be used in networks and intelligent scenarios. Its designers must keep up with the latest industry trends and technologies in order to ensure that the chip model EP3SL200H780I4LG is able to meet the demands of the future.
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2,369 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $33,654.5439 | $33,654.5439 |
| 10+ | $33,292.6671 | $332,926.6707 |
| 100+ | $31,483.2830 | $3,148,328.2992 |
| 1000+ | $29,673.8989 | $14,836,949.4560 |
| 10000+ | $27,140.7612 | $27,140,761.2000 |
| The price is for reference only, please refer to the actual quotation! | ||