EP3SL200H780I3N
EP3SL200H780I3N
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Intel Corporation

EP3SL200H780I3N


EP3SL200H780I3N
F18-EP3SL200H780I3N
Active
IC FPGA 488 I/O 780HBGA
780-HBGA (33x33)

EP3SL200H780I3N ECAD Model


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EP3SL200H780I3N Attributes


Type Description Select
Mfr Intel
Series Stratix® III L
Package Tray
Number of LABs/CLBs 8000
Number of Logic Elements/Cells 200000
Total RAM Bits 10901504
Number of I/O 488
Voltage - Supply 0.86V ~ 1.15V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-HBGA (33x33)
Base Product Number EP3SL200

EP3SL200H780I3N Datasheet Download


EP3SL200H780I3N Overview



The EP3SL200H780I3N is an FPGA (Field Programmable Gate Array) chip model manufactured by Altera. It is a 3-dimensional FPGA, meaning it comprises of three layers of logic and memory blocks, allowing for higher levels of integration and more efficient use of space.


The EP3SL200H780I3N has an array of 200,000 logic elements and 780,000 bits of embedded memory, and can deliver up to 5Gbps of bandwidth. It also has a maximum operating frequency of 500MHz and an operating voltage range of 1.2V to 1.5V. It is available in a variety of package sizes, including a 676-pin BGA and a 684-pin FBGA.


The EP3SL200H780I3N is ideal for a range of applications, including high-end networking, video, imaging and storage applications. It can be used for a variety of tasks, such as data encryption, video processing, and image recognition. It is also well suited for high-performance computing, as it can handle large amounts of data quickly and efficiently.


In conclusion, the EP3SL200H780I3N is a powerful FPGA chip model that is well suited for a range of applications. It has a high level of integration, a wide operating voltage range, and can deliver up to 5Gbps of bandwidth. It is ideal for high-end networking, video, imaging and storage applications, as well as for high-performance computing.



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