Intel Corporation
EP3SL200H780I3G
EP3SL200H780I3G ECAD Model
EP3SL200H780I3G Attributes
| Type | Description | Select |
|---|---|---|
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 200000 | |
| Number of CLBs | 8000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Organization | 8000 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 33 mm | |
| Length | 33 mm | |
| Seated Height-Max | 3.05 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | HBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL200H780I3G Datasheet Download
EP3SL200H780I3G Overview
The chip model EP3SL200H780I3G is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, a hardware description language that allows designers to create and simulate complex digital systems. This makes the model highly suitable for a variety of applications, such as automotive, consumer electronics, and medical device applications.
The EP3SL200H780I3G offers several advantages over traditional processors, including high-speed performance, low power consumption, and low cost. It is also highly compatible with a range of operating systems and development tools, making it an ideal choice for embedded applications. Additionally, the model supports a variety of communication protocols, making it suitable for a range of applications from connected devices to autonomous systems.
The EP3SL200H780I3G is expected to be in high demand in the future, as more and more applications require the use of high-performance digital signal processing and embedded processing. The model is also expected to benefit from the emergence of new technologies such as 5G, artificial intelligence, and the Internet of Things, which will create a need for more powerful and efficient processors.
In terms of the application environment, the EP3SL200H780I3G is designed to work with existing technologies, but may require the support of new technologies in order to meet the demands of specific applications. As such, the future development of related industries will depend on the specific technologies needed to meet the demands of the application environment.
Overall, the EP3SL200H780I3G is a powerful and versatile chip model that offers a range of advantages and is expected to be in high demand in the future. Its compatibility with a range of operating systems and development tools, as well as its support for a variety of communication protocols, make it an ideal choice for a variety of applications. Additionally, the model may require the support of new technologies in order to meet the demands of specific applications.
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5,636 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $33,656.8621 | $33,656.8621 |
| 10+ | $33,294.9604 | $332,949.6036 |
| 100+ | $31,485.4516 | $3,148,545.1641 |
| 1000+ | $29,675.9429 | $14,837,971.4630 |
| 10000+ | $27,142.6307 | $27,142,630.7250 |
| The price is for reference only, please refer to the actual quotation! | ||