
Intel Corporation
EP3SL200H780I3
EP3SL200H780I3 ECAD Model
EP3SL200H780I3 Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Stratix® III L | |
Package | Tray | |
Number of LABs/CLBs | 8000 | |
Number of Logic Elements/Cells | 200000 | |
Total RAM Bits | 10901504 | |
Number of I/O | 488 | |
Voltage - Supply | 0.86V ~ 1.15V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 780-BBGA, FCBGA | |
Supplier Device Package | 780-HBGA (33x33) | |
Base Product Number | EP3SL200 |
EP3SL200H780I3 Datasheet Download
EP3SL200H780I3 Overview
The EP3SL200H780I3 is a Field Programmable Gate Array (FPGA) chip model produced by Altera Corporation. It is a member of the Stratix III family, and it is a high-density, high-performance FPGA.
The EP3SL200H780I3 has a total of 1,872,000 logic elements and an equivalent of 1,872,000 4-input look-up tables (LUTs). It also has 1,280,000 flip-flops and 5,120,000 RAM bits. The chip is designed to be used in high-speed applications such as high-speed serial interfaces, high-speed networking, high-speed memory interfaces, and high-speed signal processing.
The EP3SL200H780I3 has a maximum operating frequency of 400MHz and a maximum I/O pin count of 1,536. It also has a total power dissipation of 32W and a total power consumption of 8.5W. The chip is designed to operate in temperatures ranging from -40°C to 85°C.
The EP3SL200H780I3 is ideal for applications such as digital signal processing, high-speed networking, video and image processing, and high-speed memory interfaces. It is also suitable for use in applications such as encryption, networking, and storage.
The EP3SL200H780I3 is a powerful and reliable FPGA chip model that is suitable for a wide range of applications. It is designed to provide high performance and reliability, and it is able to operate in a variety of temperature ranges.
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