EP3SL200H780I3
EP3SL200H780I3
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Intel Corporation

EP3SL200H780I3


EP3SL200H780I3
F18-EP3SL200H780I3
Active
IC FPGA 488 I/O 780HBGA
780-HBGA (33x33)

EP3SL200H780I3 ECAD Model


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EP3SL200H780I3 Attributes


Type Description Select
Mfr Intel
Series Stratix® III L
Package Tray
Number of LABs/CLBs 8000
Number of Logic Elements/Cells 200000
Total RAM Bits 10901504
Number of I/O 488
Voltage - Supply 0.86V ~ 1.15V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 780-BBGA, FCBGA
Supplier Device Package 780-HBGA (33x33)
Base Product Number EP3SL200

EP3SL200H780I3 Datasheet Download


EP3SL200H780I3 Overview



The EP3SL200H780I3 is a Field Programmable Gate Array (FPGA) chip model produced by Altera Corporation. It is a member of the Stratix III family, and it is a high-density, high-performance FPGA.


The EP3SL200H780I3 has a total of 1,872,000 logic elements and an equivalent of 1,872,000 4-input look-up tables (LUTs). It also has 1,280,000 flip-flops and 5,120,000 RAM bits. The chip is designed to be used in high-speed applications such as high-speed serial interfaces, high-speed networking, high-speed memory interfaces, and high-speed signal processing.


The EP3SL200H780I3 has a maximum operating frequency of 400MHz and a maximum I/O pin count of 1,536. It also has a total power dissipation of 32W and a total power consumption of 8.5W. The chip is designed to operate in temperatures ranging from -40°C to 85°C.


The EP3SL200H780I3 is ideal for applications such as digital signal processing, high-speed networking, video and image processing, and high-speed memory interfaces. It is also suitable for use in applications such as encryption, networking, and storage.


The EP3SL200H780I3 is a powerful and reliable FPGA chip model that is suitable for a wide range of applications. It is designed to provide high performance and reliability, and it is able to operate in a variety of temperature ranges.



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