
Intel Corporation
EP3SL200H780C4LG
EP3SL200H780C4LG ECAD Model
EP3SL200H780C4LG Attributes
Type | Description | Select |
---|---|---|
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Logic Cells | 200000 | |
Number of CLBs | 8000 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 8000 CLBS | |
Additional Feature | ALSO OPERATES AT 1.1V VCC NOMINAL | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B780 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 33 mm | |
Length | 33 mm | |
Seated Height-Max | 3.2 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | HBGA-780 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SL200H780C4LG Datasheet Download
EP3SL200H780C4LG Overview
The chip model EP3SL200H780C4LG is a high-performance and low-power FPGA device, which is suitable for applications such as high-performance digital signal processing, embedded processing, image processing, etc. It is a versatile chip model that can be used in a wide range of applications. It is possible to use the model in the era of fully intelligent systems, as the chip model is capable of processing large amounts of data quickly and accurately.
In terms of networks, the chip model EP3SL200H780C4LG can be used for various applications such as routing, switching, and wireless communication. It can be used for data transmission and storage, as well as for communication between devices. It can also be used for machine learning and artificial intelligence applications, allowing for the development of more sophisticated network systems.
In terms of intelligent scenarios, the chip model EP3SL200H780C4LG can be used in the development of intelligent robots. It can be used to process large amounts of data quickly and accurately, allowing robots to be more responsive to their environment. It can also be used to develop robots that are capable of learning and adapting to their environment.
To use the chip model EP3SL200H780C4LG effectively, it is important to have a good understanding of the HDL language. This language is used to design and program the chip model, and it is important to have a good understanding of the language in order to be able to effectively use the chip model. Additionally, it is important to have a good understanding of the various applications that the chip model can be used for, as well as the various intelligent scenarios that the chip model can be applied to. With this knowledge, it is possible to effectively use the model in the development and popularization of future intelligent robots.
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5,912 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $9,029.5411 | $9,029.5411 |
10+ | $8,932.4493 | $89,324.4928 |
100+ | $8,446.9901 | $844,699.0080 |
1000+ | $7,961.5309 | $3,980,765.4400 |
10000+ | $7,281.8880 | $7,281,888.0000 |
The price is for reference only, please refer to the actual quotation! |