EP3SL200H780C4LG
EP3SL200H780C4LG
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rohs

Intel Corporation

EP3SL200H780C4LG


EP3SL200H780C4LG
F18-EP3SL200H780C4LG
Active
FIELD PROGRAMMABLE GATE ARRAY, HBGA-780
HBGA-780

EP3SL200H780C4LG ECAD Model


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EP3SL200H780C4LG Attributes


Type Description Select
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Logic Cells 200000
Number of CLBs 8000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 8000 CLBS
Additional Feature ALSO OPERATES AT 1.1V VCC NOMINAL
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B780
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 33 mm
Length 33 mm
Seated Height-Max 3.2 mm
Ihs Manufacturer INTEL CORP
Package Description HBGA-780
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SL200H780C4LG Datasheet Download


EP3SL200H780C4LG Overview



The chip model EP3SL200H780C4LG is a high-performance and low-power FPGA device, which is suitable for applications such as high-performance digital signal processing, embedded processing, image processing, etc. It is a versatile chip model that can be used in a wide range of applications. It is possible to use the model in the era of fully intelligent systems, as the chip model is capable of processing large amounts of data quickly and accurately.


In terms of networks, the chip model EP3SL200H780C4LG can be used for various applications such as routing, switching, and wireless communication. It can be used for data transmission and storage, as well as for communication between devices. It can also be used for machine learning and artificial intelligence applications, allowing for the development of more sophisticated network systems.


In terms of intelligent scenarios, the chip model EP3SL200H780C4LG can be used in the development of intelligent robots. It can be used to process large amounts of data quickly and accurately, allowing robots to be more responsive to their environment. It can also be used to develop robots that are capable of learning and adapting to their environment.


To use the chip model EP3SL200H780C4LG effectively, it is important to have a good understanding of the HDL language. This language is used to design and program the chip model, and it is important to have a good understanding of the language in order to be able to effectively use the chip model. Additionally, it is important to have a good understanding of the various applications that the chip model can be used for, as well as the various intelligent scenarios that the chip model can be applied to. With this knowledge, it is possible to effectively use the model in the development and popularization of future intelligent robots.



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Unit Price: $9,709.184
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Pricing (USD)

QTY Unit Price Ext Price
1+ $9,029.5411 $9,029.5411
10+ $8,932.4493 $89,324.4928
100+ $8,446.9901 $844,699.0080
1000+ $7,961.5309 $3,980,765.4400
10000+ $7,281.8880 $7,281,888.0000
The price is for reference only, please refer to the actual quotation!

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