EP3SL200H780C4L
EP3SL200H780C4L
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rohs

Intel Corporation

EP3SL200H780C4L


EP3SL200H780C4L
F18-EP3SL200H780C4L
Active
FIELD PROGRAMMABLE GATE ARRAY, HBGA-780
HBGA-780

EP3SL200H780C4L ECAD Model


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EP3SL200H780C4L Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 488
Number of Outputs 488
Number of Logic Cells 200000
Number of CLBs 8000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 8000 CLBS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Power Supplies 1.2/3.3 V
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B780
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 33 mm
Length 33 mm
Seated Height-Max 3.2 mm
Ihs Manufacturer INTEL CORP
Package Description HBGA-780
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SL200H780C4L Datasheet Download


EP3SL200H780C4L Overview



The chip model EP3SL200H780C4L is a high-performance, low-power FPGA chip that is suitable for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language that allows users to describe the behavior of a digital system. This chip model is highly advantageous when compared to other FPGA chips due to its low power consumption and high performance.


The demand for the EP3SL200H780C4L chip model is expected to increase in the future, particularly in the fields of high-performance digital signal processing, embedded processing, and image processing. This is due to the chip's ability to provide a high level of performance and low power consumption, which are both essential for these types of applications. Additionally, the chip's ability to be used with the HDL language makes it even more attractive to potential customers.


The original design intention of the EP3SL200H780C4L chip model was to provide a high-performance, low-power FPGA chip that could be used for a wide range of applications. The chip model was designed to be used with the HDL language, which allows users to describe the behavior of a digital system. This design intention has been successful, as the chip model has been well received by customers due to its high performance and low power consumption.


The EP3SL200H780C4L chip model can be upgraded in the future to include more advanced features. This would allow the chip to be used in more advanced communication systems, such as 5G networks. Additionally, the chip's ability to be used with the HDL language makes it even more attractive to potential customers.


Overall, the EP3SL200H780C4L chip model is an excellent choice for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. Its low power consumption and high performance make it an attractive option for customers. Additionally, the chip's ability to be used with the HDL language allows users to describe the behavior of a digital system. The chip model can be upgraded in the future to include more advanced features, making it even more attractive for potential customers.



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Unit Price: $5,933.4376
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Pricing (USD)

QTY Unit Price Ext Price
1+ $5,518.0970 $5,518.0970
10+ $5,458.7626 $54,587.6259
100+ $5,162.0907 $516,209.0712
1000+ $4,865.4188 $2,432,709.4160
10000+ $4,450.0782 $4,450,078.2000
The price is for reference only, please refer to the actual quotation!

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