
Intel Corporation
EP3SL200H780C4L
EP3SL200H780C4L ECAD Model
EP3SL200H780C4L Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 488 | |
Number of Outputs | 488 | |
Number of Logic Cells | 200000 | |
Number of CLBs | 8000 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 8000 CLBS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Power Supplies | 1.2/3.3 V | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B780 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 33 mm | |
Length | 33 mm | |
Seated Height-Max | 3.2 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | HBGA-780 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SL200H780C4L Datasheet Download
EP3SL200H780C4L Overview
The chip model EP3SL200H780C4L is a high-performance, low-power FPGA chip that is suitable for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language that allows users to describe the behavior of a digital system. This chip model is highly advantageous when compared to other FPGA chips due to its low power consumption and high performance.
The demand for the EP3SL200H780C4L chip model is expected to increase in the future, particularly in the fields of high-performance digital signal processing, embedded processing, and image processing. This is due to the chip's ability to provide a high level of performance and low power consumption, which are both essential for these types of applications. Additionally, the chip's ability to be used with the HDL language makes it even more attractive to potential customers.
The original design intention of the EP3SL200H780C4L chip model was to provide a high-performance, low-power FPGA chip that could be used for a wide range of applications. The chip model was designed to be used with the HDL language, which allows users to describe the behavior of a digital system. This design intention has been successful, as the chip model has been well received by customers due to its high performance and low power consumption.
The EP3SL200H780C4L chip model can be upgraded in the future to include more advanced features. This would allow the chip to be used in more advanced communication systems, such as 5G networks. Additionally, the chip's ability to be used with the HDL language makes it even more attractive to potential customers.
Overall, the EP3SL200H780C4L chip model is an excellent choice for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. Its low power consumption and high performance make it an attractive option for customers. Additionally, the chip's ability to be used with the HDL language allows users to describe the behavior of a digital system. The chip model can be upgraded in the future to include more advanced features, making it even more attractive for potential customers.
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1,274 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $5,518.0970 | $5,518.0970 |
10+ | $5,458.7626 | $54,587.6259 |
100+ | $5,162.0907 | $516,209.0712 |
1000+ | $4,865.4188 | $2,432,709.4160 |
10000+ | $4,450.0782 | $4,450,078.2000 |
The price is for reference only, please refer to the actual quotation! |