Intel Corporation
EP3SL200H780C3N
EP3SL200H780C3N ECAD Model
EP3SL200H780C3N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 200000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 33 mm | |
| Length | 33 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA780,28X28,40 | |
| Pin Count | 780 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL200H780C3N Overview
The chip model EP3SL200H780C3N is a highly advanced and powerful microchip that has been gaining increasing attention in the industry. It is a highly efficient and versatile chip that can be used in a variety of applications, ranging from networks to intelligent systems.
The EP3SL200H780C3N chip model is a high-performance, low-power chip that can be used in a variety of scenarios, from high-speed communication networks to computing systems. It offers a wide range of features and capabilities, including high-speed communication, low latency, low power consumption, and high scalability.
In terms of industry trends, the EP3SL200H780C3N chip model is expected to be increasingly used in the future for a variety of applications. With its high performance and low power consumption, it is expected to be used in networks, intelligent systems, and even in the development of intelligent robots.
The EP3SL200H780C3N chip model is also expected to be used in the development and popularization of future intelligent robots, as it can provide the necessary computing power and high-speed communication capabilities. It is also expected to be used in the era of fully intelligent systems, as it is capable of handling the large amounts of data and processing power required for such systems.
In terms of technical talents, the EP3SL200H780C3N chip model requires a certain level of expertise in order to be used effectively. Those who are proficient in the use of microprocessors, computer architecture, and embedded systems are expected to be able to use the chip model effectively.
In conclusion, the EP3SL200H780C3N chip model is a highly advanced and powerful microchip that is expected to be increasingly used in the future for a variety of applications. It is expected to be used in networks, intelligent systems, and even in the development of intelligent robots, and requires a certain level of technical expertise to be used effectively. As the chip model continues to evolve, it is expected to play an important role in the development and popularization of future intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||