
Intel Corporation
EP3SL200H780C2G
EP3SL200H780C2G ECAD Model
EP3SL200H780C2G Attributes
Type | Description | Select |
---|---|---|
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 488 | |
Number of Outputs | 488 | |
Number of Logic Cells | 200000 | |
Number of CLBs | 8000 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 8000 CLBS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B780 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 33 mm | |
Length | 33 mm | |
Seated Height-Max | 3.05 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | HBGA-780 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SL200H780C2G Datasheet Download
EP3SL200H780C2G Overview
The chip model EP3SL200H780C2G has recently become a trending topic in the chip industry, as it has the potential to revolutionize the way we use technology. Developed by Altera, a leading chip manufacturer, this model is a single-chip solution that supports a wide range of applications, including network processing, data storage, and multimedia processing. This model has the potential to revolutionize the way we use technology, as it can be used in a variety of scenarios.
In terms of industry trends, the EP3SL200H780C2G chip model is expected to be used in a wide range of applications, from data centers to consumer electronics. It can be used to power networks, enabling faster communication and data transfer. It can also be used to store large amounts of data, enabling faster access and retrieval. Additionally, the chip model can be used for multimedia processing, allowing for higher resolution images and videos.
In terms of future development, the EP3SL200H780C2G chip model is expected to be used in more intelligent scenarios. This model can be used in the development of fully intelligent systems, allowing for more efficient and accurate operations. Additionally, the chip model can be used in the development of intelligent robots, allowing them to interact with their environment in more natural ways.
In terms of technical talents, the EP3SL200H780C2G chip model requires a certain level of expertise to use effectively. This model requires knowledge of digital signal processing, embedded systems, and computer architecture. Additionally, it requires knowledge of networking protocols and wireless communication, as well as experience in programming languages such as C and Assembly.
In conclusion, the EP3SL200H780C2G chip model has the potential to revolutionize the way we use technology, as it can be used in a variety of scenarios. This model is expected to be used in a wide range of applications, from data centers to consumer electronics. Additionally, the chip model can be used in the development of fully intelligent systems and intelligent robots, allowing for more efficient and accurate operations. Finally, the chip model requires a certain level of expertise to use effectively, as it requires knowledge of digital signal processing, embedded systems, and computer architecture, as well as experience in programming languages such as C and Assembly.
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4,729 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $38,446.4482 | $38,446.4482 |
10+ | $38,033.0455 | $380,330.4555 |
100+ | $35,966.0322 | $3,596,603.2203 |
1000+ | $33,899.0189 | $16,949,509.4290 |
10000+ | $31,005.2002 | $31,005,200.1750 |
The price is for reference only, please refer to the actual quotation! |