Intel Corporation
EP3SL200H780C2
EP3SL200H780C2 ECAD Model
EP3SL200H780C2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 200000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 800 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 33 mm | |
| Length | 33 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | HBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL200H780C2 Datasheet Download
EP3SL200H780C2 Overview
The chip model EP3SL200H780C2 is a powerful and versatile chip that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It is designed to be used with HDL language, which is an important programming language for hardware design.
The chip model EP3SL200H780C2 is designed to be highly efficient and reliable, and has the potential to be upgraded to meet the changing needs of the industry. It is capable of handling complex tasks, making it ideal for advanced communication systems. The chip has been designed to be able to handle a variety of tasks, from simple to complex, and is capable of handling large amounts of data quickly and accurately.
The chip model EP3SL200H780C2 is designed to be future-proof and can be upgraded to take advantage of new technologies as they become available. This means that the chip can be used in a variety of applications, from simple to complex, and can be used in applications that require the support of new technologies.
The chip model EP3SL200H780C2 is designed to be reliable, efficient, and highly versatile. It is designed to be able to handle a variety of tasks, from simple to complex, and is capable of handling large amounts of data quickly and accurately. It is an ideal choice for those looking to build a powerful and reliable system for their application. With the ability to be upgraded to take advantage of new technologies, the chip model EP3SL200H780C2 is sure to be a popular choice for many applications in the future.
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3,221 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6,216.7747 | $6,216.7747 |
| 10+ | $6,149.9277 | $61,499.2768 |
| 100+ | $5,815.6925 | $581,569.2480 |
| 1000+ | $5,481.4573 | $2,740,728.6400 |
| 10000+ | $5,013.5280 | $5,013,528.0000 |
| The price is for reference only, please refer to the actual quotation! | ||