
Intel Corporation
EP3SL200F1517C4N
EP3SL200F1517C4N ECAD Model
EP3SL200F1517C4N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 976 | |
Number of Outputs | 976 | |
Number of Logic Cells | 200000 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Clock Frequency-Max | 717 MHz | |
Power Supplies | 1.2/3.3 V | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.9 mm | |
Ihs Manufacturer | ALTERA CORP | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FBGA-1517 | |
Pin Count | 1517 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
EP3SL200F1517C4N Overview
The chip model EP3SL200F1517C4N is a powerful, high-performance digital signal processing device that is suitable for a wide range of applications, including embedded processing, image processing, and other sophisticated tasks. It is designed to be used with HDL (Hardware Description Language) and is capable of producing highly accurate and reliable results.
The EP3SL200F1517C4N is an excellent choice for a variety of applications in the field of networks and intelligent systems. It is capable of performing complex operations such as data processing, image recognition, and machine learning. It can be used to create sophisticated artificial intelligence systems that are capable of making decisions based on real-time data analysis.
The EP3SL200F1517C4N is an advanced system-on-chip (SoC) device that is designed to meet specific design requirements. It is highly customizable and can be adapted to meet the needs of a wide variety of applications. It is also capable of supporting multiple operating systems and is compatible with most modern programming languages.
The EP3SL200F1517C4N is a powerful and reliable chip that can be used to develop sophisticated intelligent systems. It is capable of performing complex tasks such as data processing, image recognition, and machine learning. It is also capable of supporting multiple operating systems and is compatible with most modern programming languages.
When using the EP3SL200F1517C4N, it is important to take into consideration the specific design requirements of the application. It is also important to consider the power consumption, the size of the chip, and the cost of production. Additionally, it is important to ensure that the chip is properly tested and certified to ensure that it is reliable and secure.
The EP3SL200F1517C4N is a powerful and reliable chip that can be used to develop sophisticated intelligent systems. It is capable of performing complex tasks such as data processing, image recognition, and machine learning. It is also capable of supporting multiple operating systems and is compatible with most modern programming languages. The EP3SL200F1517C4N is an excellent choice for a variety of applications in the field of networks and intelligent systems. It is important to consider the design requirements of the application, the power consumption, the size of the chip, and the cost of production when using the chip. Additionally, it is important to ensure that the chip is properly tested and certified to ensure that it is reliable and secure.
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