EP3SL200F1517C4N
EP3SL200F1517C4N
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rohs

Intel Corporation

EP3SL200F1517C4N


EP3SL200F1517C4N
F18-EP3SL200F1517C4N
Active
IC FPGA 976 I/O 1517FBGA
1517-FBGA (40x40)

EP3SL200F1517C4N ECAD Model


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EP3SL200F1517C4N Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 900 mV
Number of Inputs 976
Number of Outputs 976
Number of Logic Cells 200000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max 717 MHz
Power Supplies 1.2/3.3 V
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B1517
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.9 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description LEAD FREE, FBGA-1517
Pin Count 1517
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

EP3SL200F1517C4N Overview



The chip model EP3SL200F1517C4N is a powerful, high-performance digital signal processing device that is suitable for a wide range of applications, including embedded processing, image processing, and other sophisticated tasks. It is designed to be used with HDL (Hardware Description Language) and is capable of producing highly accurate and reliable results.


The EP3SL200F1517C4N is an excellent choice for a variety of applications in the field of networks and intelligent systems. It is capable of performing complex operations such as data processing, image recognition, and machine learning. It can be used to create sophisticated artificial intelligence systems that are capable of making decisions based on real-time data analysis.


The EP3SL200F1517C4N is an advanced system-on-chip (SoC) device that is designed to meet specific design requirements. It is highly customizable and can be adapted to meet the needs of a wide variety of applications. It is also capable of supporting multiple operating systems and is compatible with most modern programming languages.


The EP3SL200F1517C4N is a powerful and reliable chip that can be used to develop sophisticated intelligent systems. It is capable of performing complex tasks such as data processing, image recognition, and machine learning. It is also capable of supporting multiple operating systems and is compatible with most modern programming languages.


When using the EP3SL200F1517C4N, it is important to take into consideration the specific design requirements of the application. It is also important to consider the power consumption, the size of the chip, and the cost of production. Additionally, it is important to ensure that the chip is properly tested and certified to ensure that it is reliable and secure.


The EP3SL200F1517C4N is a powerful and reliable chip that can be used to develop sophisticated intelligent systems. It is capable of performing complex tasks such as data processing, image recognition, and machine learning. It is also capable of supporting multiple operating systems and is compatible with most modern programming languages. The EP3SL200F1517C4N is an excellent choice for a variety of applications in the field of networks and intelligent systems. It is important to consider the design requirements of the application, the power consumption, the size of the chip, and the cost of production when using the chip. Additionally, it is important to ensure that the chip is properly tested and certified to ensure that it is reliable and secure.



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