Intel Corporation
EP3SL200F1517C4LN
EP3SL200F1517C4LN ECAD Model
EP3SL200F1517C4LN Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 976 | |
| Number of Outputs | 976 | |
| Number of Logic Cells | 200000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.9 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-1517 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL200F1517C4LN Datasheet Download
EP3SL200F1517C4LN Overview
The EP3SL200F1517C4LN chip model is a powerful and versatile piece of technology, designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. This chip model is programmed using the Hardware Description Language (HDL) and is the ideal choice for applications requiring the highest levels of performance and reliability.
The EP3SL200F1517C4LN chip model has been designed with the future in mind. Its modular design allows for easy upgrades and modifications, making it a great choice for applications that require the highest levels of performance and reliability. With its powerful processing capabilities, the EP3SL200F1517C4LN chip model is the perfect choice for advanced communication systems, allowing for high data rates and low latency.
The EP3SL200F1517C4LN chip model is also well suited to the era of fully intelligent systems. Its powerful processing capabilities allow for the development of sophisticated networks and intelligent scenarios. With its advanced features, the EP3SL200F1517C4LN chip model is an ideal choice for applications that require the highest levels of performance and reliability.
In conclusion, the EP3SL200F1517C4LN chip model is an ideal choice for applications requiring high-performance digital signal processing, embedded processing, and image processing. Its modular design allows for easy upgrades and modifications, making it a great choice for applications that require the highest levels of performance and reliability. Furthermore, its powerful processing capabilities make it an ideal choice for advanced communication systems and fully intelligent systems.
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2,609 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,155.9381 | $5,155.9381 |
| 10+ | $5,100.4979 | $51,004.9794 |
| 100+ | $4,823.2970 | $482,329.6965 |
| 1000+ | $4,546.0960 | $2,273,047.9950 |
| 10000+ | $4,158.0146 | $4,158,014.6250 |
| The price is for reference only, please refer to the actual quotation! | ||