Intel Corporation
EP3SL200F1517C4L
EP3SL200F1517C4L ECAD Model
EP3SL200F1517C4L Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 976 | |
| Number of Outputs | 976 | |
| Number of Logic Cells | 200000 | |
| Number of CLBs | 8000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 8000 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1517 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL200F1517C4L Datasheet Download
EP3SL200F1517C4L Overview
The chip model EP3SL200F1517C4L is an advanced semiconductor device designed for use in a variety of applications. This chip model is capable of providing high-performance, low-power solutions for a variety of applications and industries. It is designed to meet the needs of the most demanding applications and is suitable for use in a wide range of applications.
The EP3SL200F1517C4L chip model offers a number of advantages over other chip models. It has a low power consumption, making it suitable for use in battery-operated devices. It also has a high level of integration, which allows it to be used in a variety of applications with a minimal amount of components. This chip model also has a high level of scalability, allowing it to be used in a variety of applications and industries.
The EP3SL200F1517C4L chip model is expected to experience an increasing demand in the coming years. This chip model is capable of providing high-performance and low-power solutions for a variety of applications, making it an attractive option for many industries. This chip model is also expected to be used in a variety of applications, including networks and intelligent systems.
The product description and specific design requirements of the EP3SL200F1517C4L chip model include the following features: a low power consumption, a high level of integration, a high level of scalability, and a low cost. The chip model is also designed to be used in a variety of applications, including networks and intelligent systems. It is also designed to be used in a variety of industries, such as automotive, medical, and consumer electronics.
In addition to the product description and design requirements, actual case studies and precautions should also be considered when using the EP3SL200F1517C4L chip model. It is important to consider the environment in which the chip model will be used, as well as the power requirements, as these can affect the performance of the chip model. It is also important to consider the compatibility of the chip model with other components, as well as the safety of the chip model.
The EP3SL200F1517C4L chip model is expected to be used in a variety of applications in the future, including networks and intelligent systems. This chip model is capable of providing high-performance and low-power solutions for a variety of applications, making it an attractive option for many industries. It is also expected to be used in a variety of applications, including networks and intelligent systems, in the era of fully intelligent systems.
In conclusion, the EP3SL200F1517C4L chip model is an advanced semiconductor device designed for use in a variety of applications. It offers a number of advantages over other chip models, including a low power consumption, a high level of integration, a high level of scalability, and a low cost. It is expected to experience an increasing demand in the coming years, and it is capable of providing high-performance and low-power solutions for a variety of applications. The product description and specific design requirements of the chip model should be considered, along with actual case studies and precautions, when using the chip model. Finally, the EP3SL200F1517C4L chip model is expected to be used in a variety of applications, including networks and intelligent systems, in the era of fully intelligent systems.
You May Also Be Interested In
2,284 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,671.5273 | $5,671.5273 |
| 10+ | $5,610.5431 | $56,105.4309 |
| 100+ | $5,305.6223 | $530,562.2268 |
| 1000+ | $5,000.7014 | $2,500,350.7240 |
| 10000+ | $4,573.8123 | $4,573,812.3000 |
| The price is for reference only, please refer to the actual quotation! | ||