EP3SL200F1517C3G
EP3SL200F1517C3G
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rohs

Intel Corporation

EP3SL200F1517C3G


EP3SL200F1517C3G
F18-EP3SL200F1517C3G
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-1517
FBGA-1517

EP3SL200F1517C3G ECAD Model


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EP3SL200F1517C3G Attributes


Type Description Select
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 976
Number of Outputs 976
Number of Logic Cells 200000
Number of CLBs 8000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 8000 CLBS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B1517
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-1517
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SL200F1517C3G Datasheet Download


EP3SL200F1517C3G Overview



The chip model EP3SL200F1517C3G is a high-performance digital signal processor, embedded processor, and image processor for use in high-end applications. It is specifically designed for applications requiring the use of HDL language, making it an ideal choice for networked systems and intelligent scenarios.


The EP3SL200F1517C3G is an innovative and powerful chip model that offers unparalleled performance and flexibility. It is designed to provide a high-performance, low-power solution for digital signal processing, embedded processing, and image processing tasks. Its features include a wide range of digital signal processing capabilities, including advanced motion detection, image recognition, and object tracking. It also supports a wide range of embedded processing capabilities, such as real-time control and data acquisition. Finally, it provides a powerful image processing engine that can be used to process images in real-time.


The EP3SL200F1517C3G is designed to be used in a wide range of applications, including networked systems and intelligent scenarios. It is capable of providing the necessary performance and flexibility to meet the demands of today's connected world. It can be used in the era of fully intelligent systems, providing the necessary tools and capabilities to enable the development of sophisticated applications.


When using the EP3SL200F1517C3G, it is important to understand the product description and specific design requirements for the chip model. This includes understanding the various capabilities of the chip, such as the digital signal processing capabilities, embedded processing capabilities, and image processing capabilities. It is also important to understand the various design considerations, such as the power requirements, memory requirements, and other design parameters. Additionally, it is important to understand the various precautions that must be taken when using the chip, such as avoiding over-clocking and ensuring adequate cooling.


To gain a better understanding of the EP3SL200F1517C3G, it is also important to look at actual case studies and examples of how the chip has been used in various applications. This can provide valuable insight into how the chip can be used in various scenarios and how it can be optimized for specific applications. Additionally, this can provide a better understanding of the various design considerations and precautions that must be taken when using the chip.


The chip model EP3SL200F1517C3G is an innovative and powerful processor that can be used in a wide range of applications, from networked systems and intelligent scenarios to the era of fully intelligent systems. It is important to understand the product description and specific design requirements for the chip model, as well as the various design considerations and precautions that must be taken when using the chip. Additionally, it is beneficial to look at actual case studies and examples of how the chip has been used in various applications to gain a better understanding of the chip and how it can be optimized for specific applications.



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Unit Price: $28,613.1119
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Pricing (USD)

QTY Unit Price Ext Price
1+ $26,610.1941 $26,610.1941
10+ $26,324.0629 $263,240.6295
100+ $24,893.4074 $2,489,340.7353
1000+ $23,462.7518 $11,731,375.8790
10000+ $21,459.8339 $21,459,833.9250
The price is for reference only, please refer to the actual quotation!

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