
Intel Corporation
EP3SL200F1517C3G
EP3SL200F1517C3G ECAD Model
EP3SL200F1517C3G Attributes
Type | Description | Select |
---|---|---|
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 976 | |
Number of Outputs | 976 | |
Number of Logic Cells | 200000 | |
Number of CLBs | 8000 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 8000 CLBS | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
Supply Voltage-Max | 940 mV | |
Supply Voltage-Min | 860 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1517 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP3SL200F1517C3G Datasheet Download
EP3SL200F1517C3G Overview
The chip model EP3SL200F1517C3G is a high-performance digital signal processor, embedded processor, and image processor for use in high-end applications. It is specifically designed for applications requiring the use of HDL language, making it an ideal choice for networked systems and intelligent scenarios.
The EP3SL200F1517C3G is an innovative and powerful chip model that offers unparalleled performance and flexibility. It is designed to provide a high-performance, low-power solution for digital signal processing, embedded processing, and image processing tasks. Its features include a wide range of digital signal processing capabilities, including advanced motion detection, image recognition, and object tracking. It also supports a wide range of embedded processing capabilities, such as real-time control and data acquisition. Finally, it provides a powerful image processing engine that can be used to process images in real-time.
The EP3SL200F1517C3G is designed to be used in a wide range of applications, including networked systems and intelligent scenarios. It is capable of providing the necessary performance and flexibility to meet the demands of today's connected world. It can be used in the era of fully intelligent systems, providing the necessary tools and capabilities to enable the development of sophisticated applications.
When using the EP3SL200F1517C3G, it is important to understand the product description and specific design requirements for the chip model. This includes understanding the various capabilities of the chip, such as the digital signal processing capabilities, embedded processing capabilities, and image processing capabilities. It is also important to understand the various design considerations, such as the power requirements, memory requirements, and other design parameters. Additionally, it is important to understand the various precautions that must be taken when using the chip, such as avoiding over-clocking and ensuring adequate cooling.
To gain a better understanding of the EP3SL200F1517C3G, it is also important to look at actual case studies and examples of how the chip has been used in various applications. This can provide valuable insight into how the chip can be used in various scenarios and how it can be optimized for specific applications. Additionally, this can provide a better understanding of the various design considerations and precautions that must be taken when using the chip.
The chip model EP3SL200F1517C3G is an innovative and powerful processor that can be used in a wide range of applications, from networked systems and intelligent scenarios to the era of fully intelligent systems. It is important to understand the product description and specific design requirements for the chip model, as well as the various design considerations and precautions that must be taken when using the chip. Additionally, it is beneficial to look at actual case studies and examples of how the chip has been used in various applications to gain a better understanding of the chip and how it can be optimized for specific applications.
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1,861 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $26,610.1941 | $26,610.1941 |
10+ | $26,324.0629 | $263,240.6295 |
100+ | $24,893.4074 | $2,489,340.7353 |
1000+ | $23,462.7518 | $11,731,375.8790 |
10000+ | $21,459.8339 | $21,459,833.9250 |
The price is for reference only, please refer to the actual quotation! |