Intel Corporation
EP3SL200F1517C3
EP3SL200F1517C3 ECAD Model
EP3SL200F1517C3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 976 | |
| Number of Outputs | 976 | |
| Number of Logic Cells | 200000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.9 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1517 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL200F1517C3 Datasheet Download
EP3SL200F1517C3 Overview
The EP3SL200F1517C3 chip model is a powerful device that is suitable for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, which is a hardware description language that allows for the creation of complex digital systems. This chip model is ideal for applications that require high-level performance, such as those used in telecommunications, industrial automation, and robotics.
The EP3SL200F1517C3 chip model offers several advantages over other models. It is designed to be highly efficient and reliable, with a low power consumption rate and a high clock speed. It also has a wide range of peripheral options, allowing for a variety of applications. Additionally, the chip is designed for scalability, meaning that it is capable of being upgraded to meet the demands of future applications.
The EP3SL200F1517C3 chip model is expected to become increasingly popular in the future, as its features and capabilities make it ideal for a variety of applications. It is likely to be used in networks, as well as in intelligent scenarios such as autonomous vehicles and industrial automation. Additionally, the chip is expected to be used in the era of fully intelligent systems, as its scalability and efficiency make it ideal for the development of complex systems.
Overall, the EP3SL200F1517C3 chip model is an ideal choice for a variety of applications, from high-performance digital signal processing to intelligent scenarios. Its scalability and efficiency make it a great choice for both current and future applications. As its popularity continues to grow, it is likely to be used in a variety of industries, from telecommunications to robotics.
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1,418 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,915.5480 | $4,915.5480 |
| 10+ | $4,862.6927 | $48,626.9266 |
| 100+ | $4,598.4159 | $459,841.5885 |
| 1000+ | $4,334.1391 | $2,167,069.5550 |
| 10000+ | $3,964.1516 | $3,964,151.6250 |
| The price is for reference only, please refer to the actual quotation! | ||