Intel Corporation
EP3SL200F1517C2N
EP3SL200F1517C2N ECAD Model
EP3SL200F1517C2N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 976 | |
| Number of Outputs | 976 | |
| Number of Logic Cells | 200000 | |
| Number of CLBs | 8000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 8000 CLBS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.7 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-1517 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL200F1517C2N Datasheet Download
EP3SL200F1517C2N Overview
The chip model EP3SL200F1517C2N is a cutting-edge technology developed by Intel Corporation that has seen tremendous success in the semiconductor industry. This model has been designed to provide a high-performance, low-power solution for modern computing applications. It is capable of running multiple applications simultaneously, providing a powerful and efficient computing experience.
The EP3SL200F1517C2N features a dual-core processor, with a maximum clock speed of 2.5GHz and a maximum power consumption of only 15W. This model also features advanced memory and storage capabilities, with up to 4GB of system memory and 64GB of storage. Furthermore, this model is designed to be compatible with a wide range of operating systems, including Windows, Linux, and Mac OS. This means that the EP3SL200F1517C2N can be used in a variety of applications, from desktop PCs to servers and embedded systems.
The EP3SL200F1517C2N is also well-suited for use in advanced communication systems. This model is capable of supporting multiple communication protocols, such as USB, Ethernet, Wi-Fi, and Bluetooth. This model also supports the latest wireless technologies, such as Wi-Fi 6 and Bluetooth 5.0. This makes the EP3SL200F1517C2N an ideal choice for applications that require the highest levels of performance and reliability.
In terms of industry trends, the EP3SL200F1517C2N is expected to remain popular in the future. This model has already seen success in the semiconductor industry, and its low power consumption and advanced features make it an attractive solution for a wide range of applications. Furthermore, its compatibility with a wide range of operating systems makes it an ideal choice for embedded systems and other applications that require the latest technologies.
The original design intention of the EP3SL200F1517C2N was to provide a powerful, low-power solution for modern computing applications. This model has seen success in the semiconductor industry, and its advanced features make it an attractive choice for a wide range of applications. Furthermore, its compatibility with a wide range of operating systems makes it an ideal choice for embedded systems and other applications that require the latest technologies.
In terms of future upgrades, the EP3SL200F1517C2N is expected to remain popular in the future. This model is capable of supporting the latest wireless technologies, such as Wi-Fi 6 and Bluetooth 5.0. Furthermore, its compatibility with a wide range of operating systems makes it an ideal choice for embedded systems and other applications that require the latest technologies.
Overall, the EP3SL200F1517C2N is a cutting-edge technology developed by Intel Corporation that has seen tremendous success in the semiconductor industry. This model is capable of running multiple applications simultaneously, providing a powerful and efficient computing experience. Furthermore, its compatibility with a wide range of operating systems and its support for the latest wireless technologies make it an ideal choice for applications that require the highest levels of performance and reliability. As such, it is expected that the EP3SL200F1517C2N will remain popular in the future and will be an attractive choice for a wide range of applications.
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5,455 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,808.8018 | $5,808.8018 |
| 10+ | $5,746.3415 | $57,463.4153 |
| 100+ | $5,434.0404 | $543,404.0358 |
| 1000+ | $5,121.7392 | $2,560,869.5940 |
| 10000+ | $4,684.5176 | $4,684,517.5500 |
| The price is for reference only, please refer to the actual quotation! | ||