Intel Corporation
EP3SL200F1517C2
EP3SL200F1517C2 ECAD Model
EP3SL200F1517C2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 976 | |
| Number of Outputs | 976 | |
| Number of Logic Cells | 200000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 800 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.9 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1517 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL200F1517C2 Datasheet Download
EP3SL200F1517C2 Overview
The chip model EP3SL200F1517C2 is a cutting-edge technology developed by the semiconductor industry. It is a high-performance, low-power and low-cost solution for system-on-chip (SoC) applications. This model is designed to provide a fast, efficient, and reliable platform for a wide variety of applications.
The EP3SL200F1517C2 is a high-performance, low-power and low-cost solution that can be used in various industries. It is ideal for applications such as industrial automation, automotive, medical, consumer electronics, and more. The chip model is equipped with a powerful processor, large memory, high-speed communication interfaces, and a wide range of peripherals. It is also designed to be compatible with a variety of operating systems, including Linux, Android, and Windows.
The chip model EP3SL200F1517C2 is expected to have a great demand in the future. This model is suitable for the development and popularization of future intelligent robots, and it is expected to be widely used in various industries. The chip model is also expected to be used in the development of new technologies, such as artificial intelligence and machine learning.
In order to use the chip model EP3SL200F1517C2 effectively, technical talents in the field of system design, software engineering, and hardware engineering are required. These technical talents should have the knowledge and skills to develop, debug, and maintain the chip model. They should also have the ability to integrate the chip model into existing systems and applications.
The chip model EP3SL200F1517C2 is expected to be a major trend in the semiconductor industry in the future. It is a high-performance, low-power and low-cost solution that can be used in various industries. The chip model is expected to be widely used in the development and popularization of future intelligent robots, as well as the development of new technologies. In order to use the chip model effectively, technical talents in the field of system design, software engineering, and hardware engineering are required.
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5,881 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6,389.6766 | $6,389.6766 |
| 10+ | $6,320.9704 | $63,209.7040 |
| 100+ | $5,977.4394 | $597,743.9400 |
| 1000+ | $5,633.9084 | $2,816,954.2000 |
| 10000+ | $5,152.9650 | $5,152,965.0000 |
| The price is for reference only, please refer to the actual quotation! | ||